View ST7MDT10-DVP33_1026584.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

november 2007 1/124 rev 6 st7lite0xy0, st7litesxy0 8-bit microcontroller with single voltage flash memory, data eeprom, adc, timers, spi memories ? 1k or 1.5 kbytes single voltage flash pro- gram memory with read-out protection, in-cir- cuit and in-application programming (icp and iap). 10 k write/erase cycles guaranteed, data retention: 20 years at 55 c. ? 128 bytes ram. ? 128 bytes data eeprom with read-out pro- tection. 300k write/erase cycles guaranteed, data retention: 20 years at 55 c. clock, reset and supply management ? 3-level low voltage supervisor (lvd) and aux- iliary voltage detector (avd) for safe power- on/off procedures ? clock sources: internal 1mhz rc 1% oscilla- tor or external clock ? pll x4 or x8 for 4 or 8 mhz internal clock ? four power saving modes: halt, active-halt, wait and slow interrupt management ? 10 interrupt vectors plus trap and reset ? 4 external interrupt lines (on 4 vectors) i/o ports ? 13 multifunctional bi directional i/o lines ? 9 alternate function lines ? 6 high sink outputs 2 timers ? one 8-bit lite timer (lt) with prescaler in- cluding: watchdog, 1 realtime base and 1 in- put capture. ? one 12-bit auto-reload timer (at) with output compare function and pwm 1 communication interface ? spi synchronous serial interface a/d converter ? 8-bit resolution for 0 to v dd ? fixed gain op-amp for 11-bit resolution in 0 to 250 mv range (@ 5v v dd ) ? 5 input channels instruction set ? 8-bit data manipulation ? 63 basic instructions with illegal opcode de- tection ? 17 main addressing modes ? 8 x 8 unsigned multiply instruction development tools ? full hardware/software development package device summary dip16 so16 150? qfn20 features st7litesxy0 (st7superlite) st7lite0xy0 st7lites2y0 st7lites5y0 st7lite02y0 st7lite05y0 st7lite09y0 program memory - by tes 1k 1k 1.5k 1.5k 1.5k ram (stack) - bytes 128 (64) 128 (64) 128 (64) 128 (64) 128 (64) data eeprom - bytes----128 peripherals lt timer w/ wdg, at timer w/ 1 pwm, spi lt timer w/ wdg, at timer w/ 1 pwm, spi, 8-bit adc lt timer w/ wdg, at timer w/ 1 pwm, spi lt timer w/ wdg, at timer w/ 1 pwm, spi, 8-bit adc w/ op-amp operating supply 2.4v to 5.5v cpu frequency 1mhz rc 1% + pllx4/8mhz operating temperature -40c to +85c packages so16 150?, dip16, qfn20 1
table of contents 124 2/124 st7lite0xy0, st7litesxy0 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 register & memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 flash program memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.2 main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.3 programming modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.4 icc interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.5 memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.6 related documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.7 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 data eeprom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 5.2 main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 5.3 memory access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.4 power saving modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.5 access error handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.6 data eeprom read-out protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.7 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6 central processing unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 6.2 main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 6.3 cpu registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7 supply, reset and clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.1 internal rc oscillator adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.2 phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.3 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 reset sequence manager (rsm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8 interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.1 non maskable software interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.2 external interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.3 peripheral interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.4 system integrity management (si) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9 power saving modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 9.2 slow mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.3 wait mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.4 active-halt and halt modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2
table of contents 3/124 10 i/o ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.2 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.3 unused i/o pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.4 low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.5 interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.6 i/o port implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 11 on-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 11.1 lite timer (lt) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 11.2 12-bit autoreload timer (at) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.3 serial peripheral interface (spi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 11.4 8-bit a/d converter (adc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 12 instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.1 st7 addressing modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.2 instruction groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 13 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 13.1 parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 13.2 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 13.3 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 13.4 supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 13.5 clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 13.6 memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 13.7 emc (electromagnetic compatibility) ch aracteristics . . . . . . . . . . . . . 93 13.8 i/o port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 13.9 control pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 13.10 communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . 102 13.11 8-bit adc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 14 package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 14.1 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 14.2 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 15 device configuration and ordering information . . . . . . . . . . . . . . . . . . . . . . . 112 15.1 option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 12 15.2 device ordering info rmation and transfer of customer code . . . . 114 15.3 development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 15.4 st7 application notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 16 known limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.1 execution of btjx instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.2 in-circuit programming of devices previously programmed with hard- ware watchdog option 121 16.3 in-circuit debugging with hardware watchdog . . . . . . . . . . . . . . . . . . . 121 16.4 recommendations when lvd is enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.5 clearing active interrupts outside interrupt routine . . . . . . . . . . . . 121 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 3
table of contents 4/124 to obtain the most recent version of this datasheet, please check at www.st.com please also pay special attention to the section ?known limitations? on page 121. 1
st7lite0xy0, st7litesxy0 5/124 1 description the st7lite0x and st7superlite (st7litesx) are members of the st7 microcon- troller family. all st7 devices are based on a com- mon industry-standard 8-bit core, featuring an en- hanced instruction set. the st7lite0x and st7superlite feature flash memory with byte-b y-byte in-circuit pro- gramming (icp) and in-application programming (iap) capability. under software control, the st7lite0x and st7superlite devices c an be placed in wait, slow, or halt mode, reducing power consump- tion when the application is in idle or standby state. the enhanced instruction set and addressing modes of the st7 offer bo th power and flexibility to software developers, enabling the design of highly efficient and compact application code. in addition to standard 8-bit data management, all st7 micro- controllers feature true bit manipulation, 8x8 un- signed multiplication and indirect addressing modes. for easy reference, all parametric data are located in section 13 on page 81 . figure 1. general block diagram 8-bit core alu address and data bus reset port b port a spi 8-bit adc w/ watchdog pb4:0 (5 bits) 1 mhz. rc osc internal clock control ram (128 bytes) pa7:0 (8 bits) v ss v dd power supply flash + pll x 4 or x 8 lite timer memory data eeprom (128 bytes) 12-bit auto- reload timer lvd/avd (1 or 1.5k bytes) 1
st7lite0xy0, st7litesxy0 6/124 2 pin description figure 2. 20-pin qfn package pinout figure 3. 16-pin so and dip package pinout k 2 1 3 4 5 78 910 11 12 13 14 15 17 18 19 20 mosi/ain3/pb3 miso/ain2/pb2 nc nc nc clkin/ain4/pb4 reset v dd pb0/ss /ain0 v ss pa0 (hs)/ltic pa5 (hs)/iccdata pa4 (hs) nc pa3 (hs) pa2 (hs)/atpwm0 pa7 mco/iccclk/pa6 (hs) 20ma high sink capability eix associated external interrupt vector ei1 6 sck/ain1/pb1 ei2 16 pa1 (hs) e0 e3 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 v ss v dd ss /ain0/pb0 clkin/ain4/pb4 mosi/ain3/pb3 miso/ain2/pb2 sck/ain1/pb1 reset pa0 (hs)/ltic pa1 (hs) pa7 pa6/mco/iccclk pa5 (hs)/iccdata pa4 (hs) pa3 (hs) pa2 (hs)/atpwm0 ei1 ei0 (hs) 20ma high sink capability ei x associated external interrupt vector ei2 ei3 1
st7lite0xy0, st7litesxy0 7/124 pin description (cont?d) legend / abbreviations for table 1 : type: i = input, o = output, s = supply in/output level: c= cmos 0.15v dd /0.85v dd with input trigger c t = cmos 0.3v dd /0.7v dd with input trigger output level: hs = 20ma high sink (on n-buffer only) port and control configuration: ? input: float = floating, wpu = weak pull-up, int = interrupt 1) , ana = analog ? output: od = open drain, pp = push-pull table 1. device pin description pin n pin name type level port / control main function (after reset) alternate function qfn20 so16/dip16 input output input output float wpu int ana od pp 18 1 v ss s ground 19 2 v dd s main power supply 1 3 reset i/o c t x x top priority non maskable interrupt (active low) 20 4 pb0/ain0/ss i/o c t x ei3 x x x port b0 adc analog input 0 or spi slave select (active low) 6 5 pb1/ain1/sck i/o c t x xxxx port b1 adc analog input 1 or spi clock caution: no negative current in- jection allowed on this pin. for details, refer to section 13.2.2 on page 82 5 6 pb2/ain2/miso i/o c t x xxxx port b2 adc analog input 2 or spi mas- ter in/ slave out data 7 7 pb3/ain3/mosi i/o c t x ei2 x x x port b3 adc analog input 3 or spi mas- ter out / slave in data 8 8 pb4/ain4/clkin i/o c t x xxxx port b4 adc analog input 4 or external clock input 9 9 pa7 i/o c t x ei1 x x port a7 10 10 pa6 /mco/ iccclk i/o c t x x xx port a6 main clock output/in circuit communication clock. caution: during normal opera- tion this pin must be pulled- up, internally or externally (external pull-up of 10k mandatory in noisy environment). this is to avoid en- tering icc mode unexpectedly during a reset. in the application, even if the pin is configured as output, any reset will put it back in input pull-up 11 11 pa5/ iccdata i/o c t hs x xxx port a5 in circuit communication data 12 12 pa4 i/o c t hs x xxx port a4 14 13 pa3 i/o c t hs x xxx port a3 1
st7lite0xy0, st7litesxy0 8/124 note: in the interrupt input column, ?ei x ? defines the associated external interrupt vector. if the weak pull-up col- umn (wpu) is merged with the interrupt column (int), then the i/o configuration is pull-up interrupt input, else the configuration is floating interrupt input. 15 14 pa2/atpwm0 i/o c t hs x xxx port a2 auto-reload timer pwm0 16 15 pa1 i/o c t hs x xxx port a1 17 16 pa0/ltic i/o c t hs x ei0 x x port a0 lite timer input capture pin n pin name type level port / control main function (after reset) alternate function qfn20 so16/dip16 input output input output float wpu int ana od pp 1
st7lite0xy0, st7litesxy0 9/124 3 register & memory map as shown in figure 4 and figure 5 , the mcu is ca- pable of addressing 64k bytes of memories and i/ o registers. the available memory locations consist of up to 128 bytes of register locations, 128 bytes of ram, 128 bytes of data eeprom and up to 1.5 kbytes of user program memory. the ram space in- cludes up to 64 bytes for the stack from 0c0h to 0ffh. the highest address bytes contain the user reset and interrupt vectors. the size of flash sector 0 is configurable by op- tion byte. important: memory locations marked as ?re- served? must never be accessed. accessing a re- served area can have unpredictable effects on the device. figure 4. memory map (st7lite0x) 0000h ram flash memory (1.5k) interrupt & reset vectors hw registers 0080h 007fh 0fffh (see table 2 ) 1000h 107fh ffe0h ffffh (see table 6 ) 0100h reserved 00ffh short addressing ram (zero page) 64 bytes stack 00c0h 00ffh 0080h 00bfh (128 bytes) data eeprom (128 bytes) fa00h 1080h f9ffh reserved ffdfh 1 kbytes 0.5 kbytes sector 1 sector 0 1.5k flash ffffh fc00h fbffh fa00h program memory 1000h 1001h rccr0 rccr1 see section 7.1 on page 24 ffdeh ffdfh rccr0 rccr1 see section 7.1 on page 24 1
st7lite0xy0, st7litesxy0 10/124 register and memory map (cont?d) figure 5. memory map (st7superlite) 0000h ram flash memory (1k) interrupt & reset vectors hw registers 0080h 007fh (see table 2 ) ffe0h ffffh (see table 6 ) 0100h 00ffh short addressing ram (zero page) 64 bytes stack 00c0h 00ffh 0080h 00bfh (128 bytes) fc00h fbffh reserved ffdfh 0.5 kbytes 0.5 kbytes sector 1 sector 0 1k flash ffffh fe00h fdffh fc00h program memory ffdeh ffdfh rccr0 rccr1 see section 7.1 on page 24 1
st7lite0xy0, st7litesxy0 11/124 register and memory map (cont?d) legend : x=undefined, r/w=read/write table 2. hardware register map address block register label register name reset status remarks 0000h 0001h 0002h port a padr paddr paor port a data register port a data direction register port a option register 00h 1) 00h 40h r/w r/w r/w 0003h 0004h 0005h port b pbdr pbddr pbor port b data register port b data direction register port b option register e0h 1) 00h 00h r/w r/w r/w 2) 0006h to 000ah reserved area (5 bytes) 000bh 000ch lite timer ltcsr lticr lite timer control/status register lite timer input capture register xxh xxh r/w read only 000dh 000eh 000fh 0010h 0011h 0012h 0013h auto-reload timer atcsr cntrh cntrl atrh atrl pwmcr pwm0csr timer control/status register counter register high counter register low auto-reload register high auto-reload register low pwm output control register pwm 0 control/status register 00h 00h 00h 00h 00h 00h 00h r/w read only read only r/w r/w r/w r/w 0014h to 0016h reserved area (3 bytes) 0017h 0018h auto-reload timer dcr0h dcr0l pwm 0 duty cycle register high pwm 0 duty cycle register low 00h 00h r/w r/w 0019h to 002eh reserved area (22 bytes) 0002fh flash fcsr flash contro l/status register 00h r/w 00030h eeprom eecsr data eeprom cont rol/status register 00h r/w 0031h 0032h 0033h spi spidr spicr spicsr spi data i/o register spi control register spi control/status register xxh 0xh 00h r/w r/w r/w 0034h 0035h 0036h adc adccsr adcdr adcamp a/d control status register a/d data register a/d amplifier control register 00h 00h 00h r/w read only r/w 0037h itc eicr external interrupt control register 00h r/w 0038h 0039h clocks mccsr rccr main clock contro l/status register rc oscillator control register 00h ffh r/w r/w 1
st7lite0xy0, st7litesxy0 12/124 notes : 1. the contents of the i/o port dr registers are readable only in output configuration. in input configura- tion, the values of the i/o pins are returned instead of the dr register contents. 2. the bits associated with unavailable pins must always keep their reset value. 003ah si sicsr system integrity c ontrol/status register 0xh r/w 003bh to 007fh reserved area (69 bytes) address block register label register name reset status remarks 1
st7lite0xy0, st7litesxy0 13/124 4 flash program memory 4.1 introduction the st7 single voltage extended flash (xflash) is a non-volatile memory that can be electrically erased and programmed either on a byte-by-byte basis or up to 32 bytes in parallel. the xflash devices can be programmed off-board (plugged in a programming tool) or on-board using in-circuit programming or in-application program- ming. the array matrix organisation allows each sector to be erased and reprogrammed without affecting other sectors. 4.2 main features icp (in-circuit programming) iap (in-application programming) ict (in-circuit testing) for downloading and executing user application test patterns in ram sector 0 size configurable by option byte read-out and write protection 4.3 programming modes the st7 can be programmed in three different ways: ? insertion in a programming tool. in this mode, flash sectors 0 and 1, option byte row and data eeprom can be programmed or erased. ? in-circuit programming. in this mode, flash sectors 0 and 1, option byte row and data eeprom can be programmed or erased with- out removing the device from the application board. ? in-application programming. in this mode, sector 1 and data eeprom can be pro- grammed or erased without removing the de- vice from the application board and while the application is running. 4.3.1 in-circuit programming (icp) icp uses a protocol called icc (in-circuit commu- nication) which allows an st7 plugged on a print- ed circuit board (pcb) to communicate with an ex- ternal programming device connected via cable. icp is performed in three steps: switch the st7 to icc mode (in-circuit communi- cations). this is done by driving a specific signal sequence on the iccclk/data pins while the reset pin is pulled low. when the st7 enters icc mode, it fetches a specific reset vector which points to the st7 system memory contain- ing the icc protocol routine. this routine enables the st7 to receive bytes from the icc interface. ? download icp driver code in ram from the iccdata pin ? execute icp driver code in ram to program the flash memory depending on the icp driver code downloaded in ram, flash memory programming can be fully customized (number of bytes to program, program locations, or selection of the serial communication interface for downloading). 4.3.2 in application programming (iap) this mode uses an iap driver program previously programmed in sector 0 by the user (in icp mode). this mode is fully contro lled by user software. this allows it to be adapted to the user application, (us- er-defined strategy for entering programming mode, choice of communications protocol used to fetch the data to be stored etc.) iap mode can be used to program any memory ar- eas except sector 0, which is write/erase protect- ed to allow recovery in case errors occur during the programming operation. 1
st7lite0xy0, st7litesxy0 14/124 flash program memory (cont?d) 4.4 icc interface icp needs a minimum of 4 and up to 6 pins to be connected to the programming tool. these pins are: ? reset : device reset ?v ss : device power supply ground ? iccclk: icc output serial clock pin ? iccdata: icc input serial data pin ? clkin: main clock input for external source ?v dd : application board power supply (option- al, see note 3) notes: 1. if the iccclk or iccdata pins are only used as outputs in the application, no signal isolation is necessary. as soon as the programming tool is plugged to the board, even if an icc session is not in progress, the iccclk and iccdata pins are not available for the application. if they are used as inputs by the application, isolation such as a serial resistor has to be implemented in case another de- vice forces the signal. refer to the programming tool documentation for recommended resistor val- ues. 2. during the icp session, the programming tool must control the reset pin. this can lead to con- flicts between the programming tool and the appli- cation reset circuit if it drives more than 5ma at high level (push pull output or pull-up resistor<1k). a schottky diode can be used to isolate the appli- cation reset circuit in this case. when using a classical rc network with r>1k or a reset man- agement ic with open drain output and pull-up re- sistor>1k, no additional components are needed. in all cases the user must ensure that no external reset is generated by the application during the icc session. 3. the use of pin 7 of the icc connector depends on the programming tool architecture. this pin must be connected when using most st program- ming tools (it is used to monitor the application power supply). please refer to the programming tool manual. 4. pin 9 has to be connected to the clkin pin of the st7 when the clock is not available in the ap- plication or if the selected clock option is not pro- grammed in the option byte. caution: during normal operation, iccclk pin must be pulled- up, internally or externally (exter- nal pull-up of 10k mandatory in noisy environ- ment). this is to avoid entering icc mode unex- pectedly during a reset. in the application, even if the pin is configured as output, any reset will put it back in input pull-up. figure 6. typical icc interface icc connector iccdata iccclk reset vdd he10 connector type application power supply 1 2 4 6 8 10 97 5 3 programming tool icc connector application board icc cable (see note 3) st7 clkin optional see note 1 see note 1 and caution see note 2 application reset source application i/o (see note 4) 1
st7lite0xy0, st7litesxy0 15/124 flash program memory (cont?d) 4.5 memory protection there are two different types of memory protec- tion: read out protection and write/erase protec- tion which can be applied individually. 4.5.1 read out protection readout protection, when selected provides a pro- tection against program memory content extrac- tion and against write access to flash memory. even if no protection can be considered as totally unbreakable, the feature provides a very high level of protection for a general purpose microcontroller. both program and data e 2 memory are protected. in flash devices, this protection is removed by re- programming the option. in this case, both pro- gram and data e 2 memory are automatically erased, and the device can be reprogrammed. read-out protection selection depends on the de- vice type: ? in flash devices it is enabled and removed through the fmp_r bit in the option byte. ? in rom devices it is enabled by mask option specified in the option list. 4.5.2 flash write/erase protection write/erase protection, when set, makes it impos- sible to both overwrite and erase program memo- ry. it does not apply to e 2 data. its purpose is to provide advanced security to applications and pre- vent any change being made to the memory con- tent. warning : once set, write/erase protection can never be removed. a write-protected flash device is no longer reprogrammable. write/erase protection is enabled through the fmp_w bit in the option byte. 4.6 related documentation for details on flash programming and icc proto- col, refer to the st7 flash programming refer- ence manual and to the st7 icc protocol refer- ence manual . 4.7 register description flash control/status register (fcsr) read/write reset value: 000 0000 (00h) 1st rass key: 0101 0110 (56h) 2nd rass key: 1010 1110 (aeh) note: this register is reserved for programming using icp, iap or other programming methods. it controls the xflash programming and erasing op- erations. when an epb or anothe r programming tool is used (in socket or icp mode), the rass keys are sent automatically. table 3. flash register map and reset values 70 00000optlatpgm address (hex.) register label 76543210 002fh fcsr reset value 00000 opt 0 lat 0 pgm 0 1
st7lite0xy0, st7litesxy0 16/124 5 data eeprom 5.1 introduction the electrically erasable programmable read only memory can be used as a non-volatile back- up for storing data. usin g the eeprom requires a basic access protocol described in this chapter. 5.2 main features up to 32 bytes programmed in the same cycle eeprom mono-voltage (charge pump) chained erase and programming cycles internal control of the global programming cycle duration wait mode management read-out protection figure 7. eeprom block diagram eecsr high voltage pump 0 e2lat 0 0 0 0 0 e2pgm eeprom memory matrix (1 row = 32 x 8 bits) address decoder data multiplexer 32 x 8 bits data latches row decoder data bus 4 4 4 128 128 address bus 1
st7lite0xy0, st7litesxy0 17/124 data eeprom (cont?d) 5.3 memory access the data eeprom memory read/write access modes are controlled by the e2lat bit of the eep- rom control/status register (eecsr). the flow- chart in figure 8 describes these different memory access modes. read operation (e2lat = 0) the eeprom can be read as a normal rom loca- tion when the e2lat bit of the eecsr register is cleared. on this device, data eepr om can also be used to execute machine code. take care not to write to the data eeprom while ex ecuting from it. this would result in an unexpected code being execut- ed. write operation (e2lat = 1) to access the write mode, the e2lat bit has to be set by software (the e2pgm bit remains cleared). when a write access to the eeprom area occurs, the value is latched inside the 32 data latches ac- cording to its address. when pgm bit is set by the software, all the previ- ous bytes written in the data latches (up to 32) are programmed in the eeprom cells. the effective high address (row) is determined by the last eep- rom write sequence. to avoid wrong program- ming, the user must take care that all the bytes written between two programming sequences have the same high address: only the five least significant bits of the address can change. at the end of the programming cycle, the pgm and lat bits are cleared simultaneously. note : care should be taken during the program- ming cycle. writing to the same memory location will over-program the me mory (logical and be- tween the two write access data result) because the data latches are only cleared at the end of the programming cycle and by the falling edge of the e2lat bit. it is not possible to read the latched data. this note is illustrated by the figure 10 . figure 8. data eeprom programming flowchart read mode e2lat = 0 e2pgm = 0 write mode e2lat = 1 e2pgm = 0 read bytes in eeprom area writeupto32bytes in eeprom area (with the same 11 msb of the address) start programming cycle e2lat=1 e2pgm=1 (set by software) e2lat 01 cleared by hardware 1
st7lite0xy0, st7litesxy0 18/124 data eeprom (cont?d) figure 9. data e 2 prom write operation note: if a programming cycle is interrupted (by reset action), the inte grity of the data in memory will not be guaranteed. byte 1 byte 2 byte 32 phase 1 programming cycle read operation impossible phase 2 read operation possible e2lat bit e2pgm bit writing data latches waiting e2pgm and e2lat to fall set by user application cleared by hardware ? row / byte ? 0 1 2 3 ... 30 31 physical address 0 00h...1fh 1 20h...3fh ... n nx20h...nx20h+1fh row definition 1
st7lite0xy0, st7litesxy0 19/124 data eeprom (cont?d) 5.4 power saving modes wait mode the data eeprom can enter wait mode on ex- ecution of the wfi instruction of the microcontrol- ler or when the microcontro ller enters active halt mode.the data eeprom will immediately enter this mode if there is no programming in progress, otherwise the data eeprom will finish the cycle and then enter wait mode. active halt mode refer to wait mode. halt mode the data eeprom immediately enters halt mode if the microcontroller executes the halt in- struction. ther efore the eeprom will stop the function in progress, and data may be corrupted. 5.5 access error handling if a read access occurs while e2lat = 1, then the data bus will not be driven. if a write access occurs while e2lat = 0, then the data on the bus will not be latched. if a programming cycle is interrupted (by reset action), the integrity of the data in memory will not be guaranteed. 5.6 data eeprom read-out protection the read-out protection is enabled through an op- tion bit (see option byte section). when this option is selected, the programs and data stored in the eeprom memory are protected against read-out (including a re-write protection). in flash devices, when this protection is removed by reprogramming the option byte, the entire pro- gram memory and eeprom is first automatically erased. note: both program memory and data eeprom are protected using the same option bit. figure 10. data eeprom programming cycle lat erase cycle write cycle pgm t prog read operation not possible write of data read operation possible internal programming voltage latches 1
st7lite0xy0, st7litesxy0 20/124 data eeprom (cont?d) 5.7 register description eeprom control/status register (eec- sr) read/write reset value: 0000 0000 (00h) bits 7:2 = reserved, forced by hardware to 0. bit 1 = e2lat latch access transfer this bit is set by software. it is cleared by hard- ware at the end of the programming cycle. it can only be cleared by software if the e2pgm bit is cleared. 0: read mode 1: write mode bit 0 = e2pgm programming control and status this bit is set by software to begin the programming cycle. at the end of the programming cycle, this bit is cleared by hardware. 0: programming finished or not yet started 1: programming cycle is in progress note : if the e2pgm bit is cleared during the pro- gramming cycle, the memory data is not guaran- teed. table 4. data eeprom register map and reset values 70 000000e2late2pgm address (hex.) register label 76543210 0030h eecsr reset value 000000 e2lat 0 e2pgm 0 1
st7lite0xy0, st7litesxy0 21/124 6 central processing unit 6.1 introduction this cpu has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation. 6.2 main features 63 basic instructions fast 8-bit by 8-bit multiply 17 main addressing modes two 8-bit index registers 16-bit stack pointer low power modes maskable hardware interrupts non-maskable software interrupt 6.3 cpu registers the six cpu registers shown in figure 11 are not present in the memory mapping and are accessed by specific instructions. accumulator (a) the accumulator is an 8-bit general purpose reg- ister used to hold operands and the results of the arithmetic and logic calculations and to manipulate data. index registers (x and y) in indexed addressing modes, these 8-bit registers are used to create either effective addresses or temporary storage areas for data manipulation. (the cross-assembler generates a precede in- struction (pre) to indicate that the following in- struction refers to the y register.) the y register is not affected by the interrupt auto- matic procedures (not pushed to and popped from the stack). program counter (pc) the program counter is a 16-bit register containing the address of the next instruction to be executed by the cpu. it is made of two 8-bit registers pcl (program counter low which is the lsb) and pch (program counter high which is the msb). figure 11. cpu registers accumulator x index register y index register stack pointer condition code register program counter 70 1c 11hi nz reset value = reset vector @ fffeh-ffffh 70 70 70 0 7 15 8 pch pcl 15 8 70 reset value = stack higher address reset value = 1x 11x1xx reset value = xxh reset value = xxh reset value = xxh x = undefined value 1
st7lite0xy0, st7litesxy0 22/124 cpu registers (cont?d) condition code register (cc) read/write reset value: 111x1xxx the 8-bit condition code register contains the in- terrupt mask and four flags representative of the result of the instruction just executed. this register can also be handled by the push and pop in- structions. these bits can be individually tested and/or con- trolled by specific instructions. bit 4 = h half carry . this bit is set by hardware when a carry occurs be- tween bits 3 and 4 of the alu during an add or adc instruction. it is reset by hardware during the same instructions. 0: no half carry has occurred. 1: a half carry has occurred. this bit is tested usin g the jrh or jrnh instruc- tion. the h bit is useful in bcd arithmetic subrou- tines. bit 3 = i interrupt mask . this bit is set by hardware when entering in inter- rupt or by software to disable all interrupts except the trap software interrupt. this bit is cleared by software. 0: interrupts are enabled. 1: interrupts are disabled. this bit is controlled by the rim, sim and iret in- structions and is tested by the jrm and jrnm in- structions. note: interrupts requested while i is set are latched and can be processed when i is cleared. by default an interrupt routine is not interruptible because the i bit is set by hardware at the start of the routine and reset by the iret instruction at the end of the routine. if the i bit is cleared by software in the interrupt routine, pending interrupts are serviced regardless of the priority level of the cur- rent interrupt routine. bit 2 = n negative . this bit is set and cleared by hardware. it is repre- sentative of the result sign of the last arithmetic, logical or data manipulation. it is a copy of the 7 th bit of the result. 0: the result of the last operation is positive or null. 1: the result of the last operation is negative (that is, the most signif icant bit is a logic 1). this bit is accessed by the jrmi and jrpl instruc- tions. bit 1 = z zero . this bit is set and cleared by hardware. this bit in- dicates that the result of the last arithmetic, logical or data manipulation is zero. 0: the result of the last operation is different from zero. 1: the result of the last operation is zero. this bit is accessed by the jreq and jrne test instructions. bit 0 = c carry/borrow. this bit is set and cleared by hardware and soft- ware. it indicates an overflow or an underflow has occurred during the last arithmetic operation. 0: no overflow or underflow has occurred. 1: an overflow or underflow has occurred. this bit is driven by the scf and rcf instructions and tested by the jrc and jrnc instructions. it is also affected by the ?bit test and branch?, shift and rotate instructions. 70 111hinzc 1
st7lite0xy0, st7litesxy0 23/124 cpu registers (cont?d) stack pointer (sp) read/write reset value: 00 ffh the stack pointer is a 16-bit register which is al- ways pointing to the next free location in the stack. it is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see figure 12 ). since the stack is 64 bytes deep, the 10 most sig- nificant bits are forced by hardware. following an mcu reset, or after a re set stack pointer instruc- tion (rsp), the stack pointer contains its reset val- ue (the sp5 to sp0 bits are set) which is the stack higher address. the least significant byte of the stack pointer (called s) can be directly accessed by a ld in- struction. note: when the lower limit is exceeded, the stack pointer wraps around to the stack upper limit, with- out indicating the stack overflow. the previously stored information is then overwritten and there- fore lost. the stack also wraps in case of an under- flow. the stack is used to save the return address dur- ing a subroutine call and the cpu context during an interrupt. the user may also directly manipulate the stack by means of the push and pop instruc- tions. in the case of an interrupt, the pcl is stored at the first location pointed to by the sp. then the other registers are stored in the next locations as shown in figure 12 . ? when an interrupt is received, the sp is decre- mented and the context is pushed on the stack. ? on return from interrupt, the sp is incremented and the context is popped from the stack. a subroutine call occupies two locations and an in- terrupt five location s in the stack area. figure 12. stack manipulation example 15 8 00000000 70 1 1 sp5 sp4 sp3 sp2 sp1 sp0 pch pcl sp pch pcl sp pcl pch x a cc pch pcl sp pcl pch x a cc pch pcl sp pcl pch x a cc pch pcl sp sp y call subroutine interrupt event push y pop y iret ret or rsp @ 00ffh @ 00c0h stack higher address = 00ffh stack lower address = 00c0h 1
st7lite0xy0, st7litesxy0 24/124 7 supply, reset an d clock management the device includes a ran ge of utility features for securing the application in critical situations (for example in case of a power brown-out), and re- ducing the number of external components. main features clock management ? 1 mhz internal rc oscillator (enabled by op- tion byte) ? external clock input (enabled by option byte) ? pll for multiplying the frequency by 4 or 8 (enabled by option byte) reset sequence manager (rsm) system integrity management (si) ? main supply low voltage detection (lvd) with reset generation (enabled by option byte) ? auxiliary voltage detect or (avd) with interrupt capability for monitoring the main supply (en- abled by option byte) 7.1 internal rc oscillator adjustment the st7 contains an internal rc oscillator with an accuracy of 1% for a given device, temperature and voltage. it must be calibrated to obtain the fre- quency required in the application. this is done by software writing a calibra tion value in the rccr (rc control register). whenever the microcontroller is reset, the rccr returns to its default value (ffh), i.e. each time the device is reset, the calibration value must be load- ed in the rccr. predefined calibration values are stored in eeprom for 3.0 and 5v v dd supply volt- ages at 25c, as shown in the following table. notes: ? see ?electrical characteristics? on page 81. for more information on the frequency and accuracy of the rc oscillator. ? to improve clock stabilit y and frequ ency accura- cy, it is recommended to place a decoupling ca- pacitor, typically 100nf, between the v dd and v ss pins as close as possible to the st7 device. ? these two bytes are systematically programmed by st, including on fastrom devices. conse- quently, customers intending to us e fastrom service must not use these two bytes. ? rccr0 and rccr1 calibration values will be erased if the read-out protection bit is reset after it has been set. see ?read out protection? on page 15. caution: if the voltage or temperature conditions change in the application, the frequency may need to be recalibrated. refer to application note an1324 for information on how to calibrate the rc frequency using an ex- ternal reference signal. 7.2 phase locked loop the pll can be used to multiply a 1mhz frequen- cy from the rc oscillator or the external clock by 4 or 8 to obtain f osc of 4 or 8 mhz. the pll is ena- bled and the multiplication factor of 4 or 8 is select- ed by 2 option bits. ? the x4 pll is intended for operation with v dd in the 2.4v to 3.3v range ? the x8 pll is intended for operation with v dd in the 3.3v to 5.5v range refer to section 15.1 for the option byte descrip- tion. if the pll is disabled and the rc oscillator is ena- bled, then f osc = 1mhz. if both the rc oscillator and the pll are disabled, f osc is driven by the external clock. rccr conditions st7flite09 address st7flite05/ st7flites5 address rccr0 v dd =5v t a =25c f rc =1mhz 1000h and ffdeh ffdeh rccr1 v dd =3.0v t a =25c f rc =700khz 1001h and- ffdfh ffdfh 1
st7lite0xy0, st7litesxy0 25/124 figure 13. pll output frequency timing diagram when the pll is started, after reset or wakeup from halt mode or awufh mode, it outputs the clock after a delay of t startup . when the pll output signal reaches the operating frequency, the locked bit in the sicscr register is set. full pll accuracy (acc pll ) is reached after a stabilization time of t stab (see figure 13 and 13.3.4 internal rc oscillator and pll ) refer to section 8.4.4 on page 36 for a description of the locked bit in the sicsr register. 7.3 register description main clock control/status register (mccsr) read / write reset value: 0000 0000 (00h) bits 7:2 = reserved, must be kept cleared. bit 1 = mco main clock out enable this bit is read/write by software and cleared by hardware after a reset. this bit allows to enable the mco output clock. 0: mco clock disabled, i/o port free for general purpose i/o. 1: mco clock enabled. bit 0 = sms slow mode select this bit is read/write by software and cleared by hardware after a reset. this bit selects the input clock f osc or f osc /32. 0: normal mode (f cpu = f osc 1: slow mode (f cpu = f osc /32) rc control register (rccr) read / write reset value: 1111 1111 (ffh) bits 7:0 = cr[7:0] rc oscillator frequency ad- justment bits these bits must be written immediately after reset to adjust the rc oscillato r frequency an d to obtain an accuracy of 1%. the application can store the correct value for each voltage range in eeprom and write it to this register at start-up. 00h = maximum available frequency ffh = lowest available frequency note: to tune the oscillator, write a series of differ- ent values in the register until the correct frequen- cy is reached. the fastest method is to use a di- chotomy starting with 80h. table 5. clock register map and reset values 70 000000 mco sms 4/8 x freq. locked bit set t stab t lock input output freq. t startup t 70 cr7 cr6 cr5 cr4 cr3 cr2 cr1 cr0 address (hex.) register label 76543210 0038h mccsr reset value 000000 mco 0 sms 0 0039h rccr reset value cr7 1 cr6 1 cr5 1 cr4 1 cr3 1 cr2 1 cr1 1 cr0 1 1
st7lite0xy0, st7litesxy0 26/124 supply, reset and clock management (cont?d) figure 14. clock management block diagram cr4 cr7 cr0 cr1 cr2 cr3 cr6 cr5 rccr tunable pll 1mhz -> 8mhz clkin option byte pll 1mhz -> 4mhz f osc 8mhz 4mhz 1mhz 0 to 8 mhz mccsr sms mco mco f cpu f cpu to cpu and peripherals (1ms timebase @ 8 mhz f osc ) /32 divider f osc f osc /32 f osc oscillator 1% rc f ltimer 1 0 option byte lite timer counter 8-bit /2 divider 7 0 (except lite timer) 1
st7lite0xy0, st7litesxy0 27/124 7.4 reset sequence manager (rsm) 7.4.1 introduction the reset sequence manager includes three re- set sources as shown in figure 16 : external reset source pulse internal lvd reset (low voltage detection) internal watchdog reset note: a reset can also be triggered following the detection of an illegal opcode or prebyte code. re- fer to section 11.2.1 on page 53 for further details. these sources act on the reset pin and it is al- ways kept low during the delay phase. the reset service routine vector is fixed at ad- dresses fffeh-ffffh in the st7 memory map. the basic reset sequence consists of 3 phases as shown in figure 15 : active phase depending on the reset source 256 cpu clock cycle delay reset vector fetch the 256 cpu clock cycle delay allows the oscilla- tor to stabilise and ensure s that recovery has tak- en place from the reset state. the reset vector fetch phase duration is 2 clock cycles. if the pll is enabled by option byte, it outputs the clock after an additional delay of t startup (see figure 13 ). figure 15. reset sequence phases figure 16.reset block diagram reset active phase internal reset 256 clock cycles fetch vector reset r on v dd internal reset pulse generator filter note 1 : see ?illegal opcode reset? on page 78. for mo re details on illegal opcode reset conditions. lvd reset watchdog reset illegal opcode reset 1) 1
st7lite0xy0, st7litesxy0 28/124 reset sequence manager (cont?d) 7.4.2 asynchronous external reset pin the reset pin is both an input and an open-drain output with integrated r on weak pull-up resistor. this pull-up has no fixed value but varies in ac- cordance with the input voltage. it can be pulled low by external circuitry to reset the device. see electrical characteristic section for more details. a reset signal originating from an external source must have a duration of at least t h(rstl)in in order to be recognized (see figure 17 ). this de- tection is asynchronous and therefore the mcu can enter reset state even in halt mode. the reset pin is an asynchronous signal which plays a major role in ems performance. in a noisy environment, it is recommended to follow the guidelines mentioned in the electrical characteris- tics section. 7.4.3 external power-on reset if the lvd is disabled by option byte, to start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until v dd is over the minimum level specified for the selected f osc frequency. a proper reset signal for a slow rising v dd supply can generally be provided by an external rc net- work connected to the reset pin. 7.4.4 internal low voltage detector (lvd) reset two different reset sequences caused by the in- ternal lvd circuitry can be distinguished: power-on reset voltage drop reset the device reset pin acts as an output that is pulled low when v dd st7lite0xy0, st7litesxy0 29/124 8 interrupts the st7 core may be interrupted by one of two dif- ferent methods: maskable hardware interrupts as listed in the interrupt mapping table and a non- maskable software interrupt (trap). the interrupt processing flowchart is shown in figure 18 . the maskable interrupts must be enabled by clearing the i bit in order to be serviced. however, disabled interrupts may be latched and processed when they are enabled (see external interrupts subsection). note: after reset, all interrupts are disabled. when an interrupt has to be serviced: ? normal processing is suspended at the end of the current instruction execution. ? the pc, x, a and cc registers are saved onto the stack. ? the i bit of the cc register is set to prevent addi- tional interrupts. ? the pc is then loaded with the interrupt vector of the interrupt to service and the first instruction of the interrupt service routine is fetched (refer to the interrupt mapping table for vector address- es). the interrupt service routine should finish with the iret instruction which caus es the contents of the saved registers to be recovered from the stack. note: as a consequence of the iret instruction, the i bit is cleared and the main program resumes. priority management by default, a servicing interrupt cannot be inter- rupted because the i bit is set by hardware enter- ing in interrupt routine. in the case when several interrupts are simultane- ously pending, an hardware priority defines which one will be serviced first (see the interrupt map- ping table). interrupts and low power mode all interrupts allow the processor to leave the wait low power mode. only external and specifi- cally mentioned interrupts allow the processor to leave the halt low power mode (refer to the ?exit from halt? column in th e interrupt mapping ta- ble). 8.1 non maskable software interrupt this interrupt is entered when the trap instruc- tion is executed regardless of the state of the i bit. it is serviced according to the flowchart in figure 18 . 8.2 external interrupts external interrupt vectors can be loaded into the pc register if the corresponding external interrupt occurred and if the i bit is cleared. these interrupts allow the processor to le ave the halt low power mode. the external interrupt polarity is selected through the miscellaneous register or interrupt register (if available). an external interrupt tr iggered on edge will be latched and the interrupt request automatically cleared upon entering the interrupt service routine. caution: the type of sensitivity defined in the mis- cellaneous or interrupt register (if available) ap- plies to the ei source. in case of a nanded source (as described in the i/o ports section), a low level on an i/o pin, configured as input with interrupt, masks the interrupt request even in case of rising- edge sensitivity. 8.3 peripheral interrupts different peripheral interrupt flags in the status register are able to cause an interrupt when they are active if both: ? the i bit of the cc register is cleared. ? the corresponding enable bit is set in the control register. if any of these two conditions is false, the interrupt is latched and thus remains pending. clearing an interrupt request is done by: ? writing ?0? to the corresponding bit in the status register or ? access to the status register while the flag is set followed by a read or write of an associated reg- ister. note : the clearing sequence resets the internal latch. a pending interrupt (that is, waiting for being enabled) will therefore be lost if the clear se- quence is executed. 1
st7lite0xy0, st7litesxy0 30/124 interrupts (cont?d) figure 18. interrupt processing flowchart table 6. interrupt mapping i bit set? y n iret? y n from reset load pc from interrupt vector stack pc, x, a, cc set i bit fetch next instruction execute instruction this clears i bit by default restore pc, x, a, cc from stack interrupt y n pending? n source block description register label priority order exit from halt address vector reset reset n/a highest priority lowest priority yes fffeh-ffffh trap software interrupt no fffch-fffdh 0 not used fffah-fffbh 1 ei0 external interrupt 0 yes fff8h-fff9h 2 ei1 external interrupt 1 fff6h-fff7h 3 ei2 external interrupt 2 fff4h-fff5h 4 ei3 external interrupt 3 fff2h-fff3h 5 not used fff0h-fff1h 6 not used ffeeh-ffefh 7 si avd interrupt sicsr no ffech-ffedh 8 at timer at timer output compare interrupt pwm0csr no ffeah-ffebh 9 at timer overflow interrupt atcsr yes ffe8h-ffe9h 10 lite timer lite timer input capture interrupt ltcsr no ffe6h-ffe7h 11 lite timer rtc interrupt ltcsr yes ffe4h-ffe5h 12 spi spi peripheral interrupts spicsr yes ffe2h-ffe3h 13 not used ffe0h-ffe1h 1
st7lite0xy0, st7litesxy0 31/124 interrupts (cont?d) external interrupt control register (eicr) read/write reset value: 0000 0000 (00h) bit 7:6 = is3[1:0] ei3 sensitivity these bits define the interrupt sensitivity for ei3 (port b0) according to table 7 . bit 5:4 = is2[1:0] ei2 sensitivity these bits define the interrupt sensitivity for ei2 (port b3) according to table 7 . bit 3:2 = is1[1:0] ei1 sensitivity these bits define the interrupt sensitivity for ei1 (port a7) according to table 7 . bit 1:0 = is0[1:0] ei0 sensitivity these bits define the interrupt sensitivity for ei0 (port a0) according to table 7 . notes: 1. these 8 bits can be written only when the i bit in the cc register is set. 2. changing the sensitivity of a particular external interrupt clears this pending interrupt. this can be used to clear unwanted pending interrupts. refer to section ?external interrupt function? on page 42. table 7. interrupt sensitivity bits 70 is31 is30 is21 is20 is11 is10 is01 is00 isx1 isx0 external interrupt sensitivity 0 0 falling edge & low level 0 1 rising edge only 1 0 falling edge only 1 1 rising and falling edge 1
st7lite0xy0, st7litesxy0 32/124 8.4 system integrity management (si) the system integrity management block contains the low voltage detector (lvd) and auxiliary volt- age detector (avd) functions. it is managed by the sicsr register. note: a reset can also be triggered following the detection of an illegal opcode or prebyte code. re- fer to section 12.2.1 on page 78 for further details. 8.4.1 low voltage detector (lvd) the low voltage detector function (lvd) gener- ates a static reset when the v dd supply voltage is below a v it-(lvd) reference value. this means that it secures the power-up as well as the power-down keeping the st7 in reset. the v it-(lvd) reference value for a voltage drop is lower than the v it+(lvd) reference value for power- on in order to avoid a parasitic reset when the mcu starts running and sinks current on the sup- ply (hysteresis). the lvd reset circuitry generates a reset when v dd is below: ?v it+(lvd) when v dd is rising ?v it-(lvd) when v dd is falling the lvd function is illustrated in figure 19 . the voltage threshold can be configured by option byte to be low, medium or high. see section 15.1 on page 112 . provided the minimum v dd value (guaranteed for the oscillator frequency) is above v it-(lvd) , the mcu can only be in two modes: ? under full software control ? in static safe reset in these conditions, secure operation is always en- sured for the application without the need for ex- ternal reset hardware. during a low voltage de tector reset, the reset pin is held low, thus permitting the mcu to reset other devices. notes : the lvd is an optional function which can be se- lected by option byte. see section 15.1 on page 112 . it allows the device to be used without any external reset circuitry. if the lvd is disabled, an external circuitry must be used to ensure a proper power-on reset. it is recommended to make sure that the v dd sup- ply voltage rises monotonously when the device is exiting from reset, to ensure the application func- tions properly. caution: if an lvd reset occurs after a watchdog reset has occurred, the lvd will take priority and will clear the watchdog flag. figure 19. low voltage detector vs reset v dd v it+ (lvd) reset v it- (lvd) v hys 1
st7lite0xy0, st7litesxy0 33/124 figure 20. reset and supply management block diagram low voltage detector (lvd) auxiliary voltage detector (avd) reset v ss v dd reset sequence manager (rsm) avd interrupt request system integrity management watchdog sicsr timer (wdg) avd avd lvd rf ie 0 f 0 status flag 0 0 loc ked 7 0 1
st7lite0xy0, st7litesxy0 34/124 system integrity management (cont?d) 8.4.2 auxiliary voltage detector (avd) the voltage detector function (avd) is based on an analog comparison between a v it-(avd) and v it+(avd) reference value and the v dd main sup- ply voltage (v avd ). the v it-(avd) reference value for falling voltage is lower than the v it+(avd) refer- ence value for rising voltage in order to avoid par- asitic detection (hysteresis). the output of the avd comparator is directly read- able by the application software through a real time status bit (avdf) in the sicsr register. this bit is read only. caution : the avd functions only if the lvd is en- abled through the option byte. 8.4.2.1 monitoring the v dd main supply the avd voltage threshold value is relative to the selected lvd threshold configured by option byte (see section 15.1 on page 112 ). if the avd interrupt is enabled, an interrupt is gen- erated when the voltage crosses the v it+(lvd) or v it-(avd) threshold (avdf bit is set). in the case of a drop in voltage, the avd interrupt acts as an early warning, allowing software to shut down safely before the lvd resets the microcon- troller. see figure 21 . the interrupt on the rising edge is used to inform the application that the v dd warning state is over figure 21. using the avd to monitor v dd v dd v it+(avd) v it-(avd) avdf bit 01 reset if avdie bit = 1 v hyst avd interrupt request interrupt cleared by v it+(lvd) v it-(lvd) lvd reset early warning interrupt (power has dropped, mcu not not yet in reset) 0 1 hardware interrupt cleared by reset 1
st7lite0xy0, st7litesxy0 35/124 system integrity management (cont?d) 8.4.3 low power modes 8.4.3.1 interrupts the avd interrupt event generates an interrupt if the corresponding enable control bit (avdie) is set and the interrupt mask in the cc register is re- set (rim instruction). mode description wait no effect on si. avd interrupts cause the device to exit from wait mode. halt the sicsr register is frozen. the avd remains active but the avd inter- rupt cannot be used to exit from halt mode. interrupt event event flag enable control bit exit from wait exit from halt avd event avdf avdie yes no 1
st7lite0xy0, st7litesxy0 36/124 system integrity management (cont?d) 8.4.4 register description system integrity (si) control/status register (sicsr) read/write reset value: 0000 0x00 (0xh) bit 7:4 = reserved, must be kept cleared. bit 3 = locked pll locked flag this bit is set by hardware. it is cleared only by a power-on reset. it is set automatically when the pll reaches its operating frequency. 0: pll not locked 1: pll locked bit 2 = lvdrf lvd reset flag this bit indicates that the last reset was generat- ed by the lvd block. it is set by hardware (lvd re- set) and cleared by software (writing zero). see wdgrf flag description in section 11.1 for more details. when the lvd is disabled by option byte, the lvdrf bit value is undefined. bit 1 = avdf voltage detector flag this read-only bit is set and cleared by hardware. if the avdie bit is set, an interrupt request is gen- erated when the avdf bit is set. refer to figure 21 for additional details 0: v dd over avd threshold 1: v dd under avd threshold bit 0 = avdie voltage detector interrupt enable this bit is set and cleared by software. it enables an interrupt to be generated when the avdf flag is set. the pending interrupt information is automati- cally cleared when software enters the avd inter- rupt routine. 0: avd interrupt disabled 1: avd interrupt enabled application notes the lvdrf flag is not cleared when another re- set type occurs (external or watchdog), the lvdrf flag remains set to keep trace of the origi- nal failure. in this case, a watchdog reset can be detected by software while an external reset can not. table 8. system integrity register map and reset values 70 0000 lock ed lvdrf avdf avdie address (hex.) register label 76543210 003ah sicsr reset value 0000 locked 0 lvdrf x avdf 0 avdie 0 1
st7lite0xy0, st7litesxy0 37/124 9 power saving modes 9.1 introduction to give a large measure of flexibility to the applica- tion in terms of power consumption, four main power saving modes are implemented in the st7 (see figure 22 ): slow, wait (slow wait), ac- tive halt and halt. after a reset the normal operating mode is se- lected by default (run mode). this mode drives the device (cpu and embedded peripherals) by means of a master clock which is based on the main oscillator frequency (f osc ). from run mode, the different power saving modes may be selected by setting the relevant register bits or by callin g the specific st7 software instruction whose action depends on the oscillator status. figure 22. power saving mode transitions 9.2 slow mode this mode has two targets: ? to reduce power consumption by decreasing the internal clock in the device, ? to adapt the internal clock frequency (f cpu ) to the available supply voltage. slow mode is controlled by the sms bit in the mccsr register which enables or disables slow mode. in this mode, the oscillato r frequency is divided by 32. the cpu and peripherals are clocked at this lower frequency. notes : slow-wait mode is activated when entering wait mode while the devi ce is already in slow mode. slow mode has no effect on the lite timer which is already clocked at f osc/32 . figure 23. slow mode clock transition power consumption wait slow run active halt high low slow wait halt sms f cpu normal run mode request f osc f osc /32 f osc 1
st7lite0xy0, st7litesxy0 38/124 power saving modes (cont?d) 9.3 wait mode wait mode places the mcu in a low power con- sumption mode by stopping the cpu. this power saving mode is selected by calling the ?wfi? instruction. all peripherals remain active. during wait mode, the i bit of the cc register is cleared, to enable all interrupts. all other registers and memory remain unchanged. the mcu remains in wait mode until an interrupt or reset occurs, whereupon the pro- gram counter branches to the starting address of the interrupt or reset service routine. the mcu will remain in wa it mode until a reset or an interrupt occurs, causing it to wake up. refer to figure 24 . figure 24. wait mode flow-chart note: 1. before servicing an inte rrupt, the cc register is pushed on the stack. the i bit of the cc register is set during the interrupt routine and cleared when the cc register is popped. wfi instruction reset interrupt y n n y cpu oscillator peripherals ibit on on 0 off fetch reset vector or service interrupt cpu oscillator peripherals ibit on off 0 on cpu oscillator peripherals ibit on on x 1) on 256 cpu clock cycle delay 1
st7lite0xy0, st7litesxy0 39/124 power saving modes (cont?d) 9.4 active-halt and halt modes active-halt and halt modes are the two low- est power consumption modes of the mcu. they are both entered by executing the ?halt? instruc- tion. the decision to enter either in active-halt or halt mode is given by the ltcsr/atcsr reg- ister status as shown in the following table:. 9.4.1 active-halt mode active-halt mode is the lowest power con- sumption mode of the mcu with a real time clock available. it is entered by executing the ?halt? in- struction when active halt mode is enabled. the mcu can exit active-halt mode on recep- tion of a lite timer / at timer interrupt or a re- set. ? when exiting active-halt mode by means of a reset, a 256 cpu cycle delay occurs. after the start up delay, the cpu resumes operation by fetching the reset vector which woke it up (see figure 26 ). ? when exiting active-halt mode by means of an interrupt, the cpu immediately resumes oper- ation by servicing the inte rrupt vector which woke it up (see figure 26 ). when entering active-halt mode, the i bit in the cc register is cleared to enable interrupts. therefore, if an interrupt is pending, the mcu wakes up immediately. in active-halt mode, on ly the main oscillator and the selected timer counter (lt/at) are running to keep a wake-up time base. all other peripherals are not clocked except those which get their clock supply from another clock generator (such as ex- ternal or auxilia ry oscillator). caution: as soon as active-halt is enabled, executing a halt instruction while the watchdog is active does not generate a reset if the wdghalt bit is reset. this means that the device cannot spend more than a defined delay in this power saving mode. figure 25. active-halt timing overview figure 26. active-halt mode flow-chart notes: 1. this delay occurs only if the mcu exits active- halt mode by means of a reset. 2. peripherals clocked with an external clock source can still be active. 3. only the lite timer rtc and at timer interrupts can exit the mcu from active-halt mode. 4. before servicing an interr upt, the cc register is pushed on the stack. the i bit of the cc register is set during the interrupt routine and cleared when the cc register is popped. ltcsr tbie bit atcsr ovfie bit atcsr ck1 bit atcsr ck0 bit meaning 0xx0 active-halt mode disabled 00xx 0111 1xxx active-halt mode enabled x101 halt run run 256 cpu cycle delay 1) reset or interrupt halt instruction fetch vector active [active halt enabled] halt instruction reset interrupt 3) y n n y cpu oscillator peripherals 2) ibit on off 0 off fetch reset vector or service interrupt cpu oscillator peripherals 2) ibit on off x 4) on cpu oscillator peripherals ibits on on x 4) on 256 cpu clock cycle delay (active halt enabled) 1
st7lite0xy0, st7litesxy0 40/124 power saving modes (cont?d) 9.4.2 halt mode the halt mode is the lo west power consumption mode of the mcu. it is entered by executing the ?halt? instruction when ac tive halt mode is disa- bled. the mcu can exit halt mode on reception of ei- ther a specific interrupt (see table 6, ?interrupt mapping,? on page 30) or a reset. when exiting halt mode by means of a reset or an interrupt, the oscillator is immedi ately turned on and the 256 cpu cycle delay is used to stabilize the oscillator. after the start up delay, the cpu resumes opera- tion by servicing the interrupt or by fetching the re- set vector which woke it up (see figure 28 ). when entering halt mode, the i bit in the cc reg- ister is forced to 0 to enable interrupts. therefore, if an interrupt is pending, the mcu wakes immedi- ately. in halt mode, the main oscillator is turned off causing all internal processing to be stopped, in- cluding the operation of the on-chip peripherals. all peripherals are not clocked except the ones which get their clock supply from another clock generator (such as an external or auxiliary oscilla- tor). the compatibility of wa tchdog operation with halt mode is configured by the ?wdghalt? op- tion bit of the option byte. the halt instruction when executed while the watchdog system is en- abled, can generate a watchdog reset (see sec- tion 15.1 on page 112 for more details). figure 27. halt timing overview figure 28. halt mode flow-chart notes: 1. wdghalt is an option bit. see option byte sec- tion for more details. 2. peripheral clocked with an external clock source can still be active. 3. only some specific inte rrupts can exit the mcu from halt mode (such as external interrupt). re- fer to table 6, ?interrupt mapping,? on page 30 for more details. 4. before servicing an inte rrupt, the cc register is pushed on the stack. the i bit of the cc register is set during the interrupt routine and cleared when the cc register is popped. 5. if the pll is enabled by option byte, it outputs the clock after a delay of t startup (see figure 13 ). halt run run 256 cpu cycle delay reset or interrupt halt instruction fetch vector [ active halt disabled ] halt instruction reset interrupt 3) y n n y cpu oscillator peripherals 2) ibit off off 0 off fetch reset vector or service interrupt cpu oscillator peripherals ibit on off x 4) on cpu oscillator peripherals ibits on on x 4) on 256 cpu clock cycle delay watchdog enable disable wdghalt 1) 0 watchdog reset 1 (active halt disabled) 1
st7lite0xy0, st7litesxy0 41/124 power saving modes (cont?d) 9.4.2.1 halt mode recommendations ? make sure that an external event is available to wake up the microcontroller from halt mode. ? when using an external interrupt to wake up the microcontroller, reinitia lize the corresponding i/o as ?input pull-up with interrupt? before executing the halt instruction. the main reason for this is that the i/o may be wrongly configured due to ex- ternal interference or by an unforeseen logical condition. ? for the same reason, reinitialize the level sensi- tiveness of each external interrupt as a precau- tionary measure. ? the opcode for the halt instruction is 0x8e. to avoid an unexpected halt instruction due to a program counter failure, it is advised to clear all occurrences of the data value 0x8e from memo- ry. for example, avoid defining a constant in rom with the value 0x8e. ? as the halt instruction clears the i bit in the cc register to allow interrupts, the user may choose to clear all pending interrupt bits before execut- ing the halt instruction. this avoids entering other peripheral interrupt routines after executing the external interrupt routine corresponding to the wake-up event (reset or external interrupt). 1
st7lite0xy0, st7litesxy0 42/124 10 i/o ports 10.1 introduction the i/o ports offer different functional modes: ? transfer of data through digital inputs and outputs and for specific pins: ? external interrupt generation ? alternate signal input/output for the on-chip pe- ripherals. an i/o port contains up to 8 pins. each pin can be programmed independently as digital input (with or without interrupt generation) or digital output. 10.2 functional description each port has 2 main registers: ? data register (dr) ? data direction register (ddr) and one optional register: ? option register (or) each i/o pin may be programmed using the corre- sponding register bits in the ddr and or regis- ters: bit x corresponding to pin x of the port. the same correspondence is used for the dr register. the following description takes into account the or register, (for specific ports which do not pro- vide this register refer to the i/o port implementa- tion section). the generic i/o block diagram is shown in figure 29 10.2.1 input modes the input configuration is selected by clearing the corresponding ddr register bit. in this case, reading the dr register returns the digital value applied to the external i/o pin. different input modes can be selected by software through the or register. note : writing the dr register modifies the latch value but does not affect the pin status. external interrupt function when an i/o is configured as input with interrupt, an event on this i/o can generate an external inter- rupt request to the cpu. each pin can independently generate an interrupt request. the interrupt sensitivity is independently programmable using the sensitivity bits in the eicr register. each external interrupt vector is linked to a dedi- cated group of i/o port pins (see pinout description and interrupt section). if several input pins are se- lected simultaneously as interrupt source, these are logically anded. for this reason if one of the interrupt pins is tied low, it may mask the others. external interrupts are hardware interrupts. fetch- ing the corresponding interrupt vector automatical- ly clears the request latch. changing the sensitivity of a particular external interrupt clears this pending interrupt. this can be used to clear unwanted pending interrupts. spurious interrupts when enabling/disabling an external interrupt by setting/resetting the related or register bit, a spu- rious interrupt is generated if the pin level is low and its edge sensitivity includes falling/rising edge. this is due to the edge detector input which is switched to '1' when the external interrupt is disa- bled by the or register. to avoid this unwanted interrupt, a "safe" edge sensitivity (rising edge for enabling and falling edge for disabling) has to be selected before changing the or register bit and configuring the appropriate sensitivity again. caution: in case a pin level change occurs during these operations (asynchro nous signal input), as interrupts are generated according to the current sensitivity, it is advised to disable all interrupts be- fore and to reenable them after the complete pre- vious sequence in order to avoid an external inter- rupt occurring on the unwanted edge. this corresponds to the following steps: 1. to enable an external interrupt: ? set the interrupt mask with the sim instruction (in cases where a pin level change could oc- cur) ? select rising edge ? enable the external interrupt through the or register ? select the desired sensitivity if different from rising edge ? reset the interrupt ma sk with the rim instruc- tion (in cases where a pin level change could occur) 2. to disable an external interrupt: ? set the interrupt mask with the sim instruction sim (in cases where a pin level change could occur) ? select falling edge ? disable the external interrupt through the or register ? select rising edge 1
st7lite0xy0, st7litesxy0 43/124 ? reset the interrupt ma sk with the rim instruc- tion (in cases where a pin level change could occur) output modes the output configuration is selected by setting the corresponding ddr register bit. in this case, writ- ing the dr register applies this digital value to the i/o pin through the latch. then reading the dr reg- ister returns the previously stored value. two different output modes can be selected by software through the or register: output push-pull and open-drain. dr register value and output pin status: note: when switching from input to output mode, the dr register has to be written first to drive the correct level on the pin as soon as the port is con- figured as an output. 10.2.2 alternate functions when an on-chip peripheral is configured to use a pin, the alternate function is automatically select- ed. this alternate function takes priority over the standard i/o programming under the following conditions: ? when the signal is coming from an on-chip pe- ripheral, the i/o pin is automatically configured in output mode (push-pull or open drain according to the peripheral). ? when the signal is going to an on-chip peripher- al, the i/o pin must be configured in floating input mode. in this case, the pin state is also digitally readable by addressing the dr register. notes : ? input pull-up configuration can cause unexpect- ed value at the input of the alternate peripheral input. ? when an on-chip peripheral use a pin as input and output, this pin has to be configured in input floating mode. dr push-pull open-drain 0v ss vss 1v dd floating 1
st7lite0xy0, st7litesxy0 44/124 i/o ports (cont?d) figure 29. i/o port general block diagram table 9. i/o port mode options legend : ni - not implemented off - implemented not activated on - implemented and activated configuration mode pull-up p-buffer diodes to v dd to v ss input floating with/without interrupt off off on on pull-up with/without interrupt on output push-pull off on open drain (logic level) off dr ddr or data bus pad v dd alternate enable alternate output 1 0 or sel ddr sel dr sel pull-up condition p-buffer (see table below) n-buffer pull-up (see table below) 1 0 analog input if implemented alternate input v dd diodes (see table below) from other bits external source (ei x ) interrupt polarity selection cmos schmitt trigger register access 1
st7lite0xy0, st7litesxy0 45/124 i/o ports (cont?d) table 10. i/o port configurations notes: 1. when the i/o port is in input configuration and the associated alternate function is enabled as an output, reading the dr register will read the alternate function output status. 2. when the i/o port is in output configuration and the associated alternate function is enabled as an input, the alternate function reads the pin status given by the dr register content. hardware configuration input 1) open-drain output 2) push-pull output 2) condition pad v dd r pu external interrupt polarity data b u s pull-up interrupt dr register access w r from other pins source (ei x ) selection dr register condition alternate input analog input pad r pu data b u s dr dr register access r/w v dd alternate alternate enable output register pad r pu data b u s dr dr register access r/w v dd alternate alternate enable output register 1
st7lite0xy0, st7litesxy0 46/124 i/o ports (cont?d) caution : the alternate function must not be ac- tivated as long as the pin is configured as input with interrupt, in order to avoid generating spurious interrupts. analog alternate function when the pin is used as an adc input, the i/o must be configured as floating input. the analog multiplexer (controlled by the adc registers) switches the analog voltage present on the select- ed pin to the common analog rail which is connect- ed to the adc input. it is recommended not to change the voltage level or loading on any port pin while conversion is in progress. furthermore it is recommended not to have clocking pins located close to a selected an- alog pin. warning: the analog input voltage level must be within the limits stated in the absolute maxi- mum ratings. 10.3 unused i/o pins unused i/o pins must be connected to fixed volt- age levels. refer to section 13.8 . 10.4 low power modes 10.5 interrupts the external interrupt event generates an interrupt if the corresponding configuration is selected with ddr and or registers and the interrupt mask in the cc register is not active (rim instruction). 10.6 i/o port implementation the hardware implementation on each i/o port de- pends on the settings in the ddr and or registers and specific feature of the i/o port such as adc in- put. switching these i/o ports from one state to anoth- er should be done in a sequence that prevents un- wanted side effects. recommended safe transi- tions are illustrated in figure 30 other transitions are potentially risky and should be avoided, since they are likely to present unwanted side-effects such as spurious interrupt generation. figure 30. interrupt i/o port state transitions the i/o port register configurations are summa- rised as follows. table 11. port configuration mode description wait no effect on i/o ports. external interrupts cause the device to exit from wait mode. halt no effect on i/o ports. external interrupts cause the device to exit from halt mode. interrupt event event flag enable control bit exit from wait exit from halt external interrupt on selected external event - ddrx orx yes yes 01 floating/pull-up interrupt input 00 floating (reset state) input 10 open-drain output 11 push-pull output xx = ddr, or port pin name input (ddr=0) output (ddr=1) or = 0 or = 1 or = 0 or = 1 port a pa7 floating pull-up interrupt open drain push-pull pa6:1 floating pull-up open drain push-pull pa0 floating pull-up interrupt open drain push-pull port b pb4 floating pull-up open drain push-pull pb3 floating pull-up interrupt open drain push-pull pb2:1 floating pull-up open drain push-pull pb0 floating pull-up interrupt open drain push-pull 1
st7lite0xy0, st7litesxy0 47/124 i/o ports (cont?d) table 12. i/o port register map and reset values address (hex.) register label 76543210 0000h padr reset value msb 0000000 lsb 0 0001h paddr reset value msb 0000000 lsb 0 0002h paor reset value msb 0100000 lsb 0 0003h pbdr reset value msb 1110000 lsb 0 0004h pbddr reset value msb 0000000 lsb 0 0005h pbor reset value msb 0000000 lsb 0 1
st7lite0xy0, st7litesxy0 48/124 11 on-chip peripherals 11.1 lite timer (lt) 11.1.1 introduction the lite timer can be used for general-purpose timing functions. it is based on a free-running 8-bit upcounter with two software-selectable timebase periods, an 8-bit input capture register and watch- dog function. 11.1.2 main features realtime clock ? 8-bit upcounter ? 1 ms or 2 ms timebase period (@ 8 mhz f osc ) ? maskable timebase interrupt input capture ? 8-bit input capture register (lticr) ? maskable interrupt with wakeup from halt mode capability watchdog ? enabled by hardware or software (configura- ble by option byte) ? optional reset on halt instruction (configura- ble by option byte) ? automatically resets the device unless disable bit is refreshed ? software reset (forced watchdog reset) ? watchdog reset status flag figure 31. lite timer block diagram ltcsr watchdog 8-bit upcounter /2 8-bit f ltimer f wdg 8 ltic f osc /32 wdgd wdge wdg tbf tbie tb icf icie watchdog reset lttb interrupt request ltic interrupt request lticr input capture register 1 0 1 or 2 ms timebase (@ 8 mhz f osc ) to 12-bit at timer f ltimer rf 0 7 1
st7lite0xy0, st7litesxy0 49/124 lite timer (cont?d) 11.1.3 functional description the value of the 8-bit counter cannot be read or written by software. after an mcu reset, it starts incrementing from 0 at a frequency of f osc /32. a counter overflow event occurs when the counter rolls over from f9h to 00h. if f osc = 8 mhz, then the time period between two counter overflow events is 1 ms. this peri od can be doubled by set- ting the tb bit in the ltcsr register. when the timer overflows, the tbf bit is set by hardware and an interrupt request is generated if the tbie is set. the tbf bit is cleared by software reading the ltcsr register. 11.1.3.1 watchdog the watchdog is enabled using the wdge bit. the normal watchdog timeout is 2ms (@ = 8 mhz f osc ), after which it then generates a reset. to prevent this watchdog reset occuring, software must set the wdgd bit. the wdgd bit is cleared by hardware after t wdg . this means that software must write to the wdgd bit at regular intervals to prevent a watchdog reset occurring. refer to fig- ure 32 . if the watchdog is not enabled immediately after reset, the first watchd og timeout will be shorter than 2ms, because this period is counted starting from reset. moreover, if a 2ms period has already elapsed after the last mcu reset, the watchdog re- set will take place as soon as the wdge bit is set. for these reasons, it is recommended to enable the watchdog immediately after reset or else to set the wdgd bit before the wgde bit so a watchdog reset will not o ccur for at least 2ms. a watchdog reset can be forced at any time by setting the wdgrf bit. to generate a forced watchdog reset, first watchdog has to be activated by setting the wdge bit and then the wdgrf bit has to be set. the wdgrf bit also acts as a flag, indicating that the watchdog was the source of the reset. it is au- tomatically cleared after it has been read. caution: when the wdgrf bit is set, software must clear it, otherwise the next time the watchdog is enabled (by hardware or software), the micro- controller will be immediately reset. hardware watchdog option if hardware watchdog is selected by option byte, the watchdog is always active and the wdge bit in the ltcsr is not used. refer to the option byte description in the "device configuration and ordering information" section. using halt mode with the watchdog (option) if the watchdog reset on halt option is not se- lected by option byte, the halt mode can be used when the watchdog is enabled. in this case, the halt in struction stops the oscilla- tor. when the oscillator is stopped, the lite timer stops counting and is no longer able to generate a watchdog reset until the microcontroller receives an external interrupt or a reset. if an external interrupt is received, the wdg re- starts counting after 256 cpu clocks. if a reset is generated, the watchdog is disabled (reset state). if halt mode with watchdog is enabled by option byte (no watchdog reset on halt instruction), it is recommended before executing the halt instruc- tion to refresh the wdg counter, to avoid an unex- pected wdg reset immediately after waking up the microcontroller. 1
st7lite0xy0, st7litesxy0 50/124 lite timer (cont?d) figure 32. watchdog timing diagram t wdg f wdg internal watchdog reset wdgd bit software sets wdgd bit hardware clears wdgd bit watchdog reset (2ms @ 8 mhz f osc ) 1
st7lite0xy0, st7litesxy0 51/124 lite timer (cont?d) input capture the 8-bit input capture register is used to latch the free-running upcounter after a rising or falling edge is detected on the ltic pin. when an input capture occurs, the icf bit is set and the lticr register contains the value of the free-running upcounter. an interrupt is generated if the icie bit is set. the icf bit is cleared by reading the lticr register. the lticr is a read only register and always con- tains the data from the last input capture. input capture is inhibited if the icf bit is set. 11.1.4 low power modes 11.1.5 interrupts note: the tbf and icf interrupt events are con- nected to separate interrupt vectors (see inter- rupts chapter). timebase and ic events generate an interrupt if the enable bit is set in the ltcsr register and the interrupt mask in the cc re gister is reset (rim in- struction). figure 33. input capture timing diagram mode description slow no effect on lite timer (this peripheral is driven directly by f osc /32) wait no effect on lite timer active halt no effect on lite timer halt lite timer stops counting interrupt event event flag enable control bit exit from wait exit from halt exit from active- halt timebase event tbf tbie yes no yes ic event icf icie no 04h 8-bit counter t 01h f osc /32 xxh 02h 03h 05h 06h 07h 04h ltic pin icf flag lticr register cleared 4s (@ 8 mhz f osc ) f cpu by s/w 07h reading ltic register 1
st7lite0xy0, st7litesxy0 52/124 lite timer (cont?d) 11.1.6 register description lite timer control/status register (ltcsr) read / write reset value: 0x00 0000 (x0h) bit 7 = icie interrupt enable this bit is set and cleared by software. 0: input capture (ic) interrupt disabled 1: input capture (ic) interrupt enabled bit 6 = icf input capture flag this bit is set by hardware and cleared by software by reading the lticr register. writing to this bit does not change the bit value. 0: no input capture 1: an input capture has occurred note: after an mcu reset, so ftware must initialise the icf bit by reading the lticr register bit 5 = tb timebase period selection this bit is set and cleared by software. 0: timebase period = t osc * 8000 (1ms @ 8 mhz) 1: timebase period = t osc * 16000 (2ms @ 8 mhz) bit 4 = tbie timebase interrupt enable this bit is set and cleared by software. 0: timebase (tb) interrupt disabled 1: timebase (tb) interrupt enabled bit 3 = tbf timebase interrupt flag this bit is set by hardware and cleared by software reading the ltcsr register. writing to this bit has no effect. 0: no counter overflow 1: a counter overflow has occurred bit 2 = wdgrf force reset/ reset status flag this bit is used in two ways: it is set by software to force a watchdog reset. it is set by hardware when a watchdog reset occurs and cleared by hardware or by software. it is cleared by hardware only when an lvd reset occurs. it can be cleared by software after a read access to the ltcsr register. 0: no watchdog reset occurred. 1: force a watchdog reset (write), or, a watchdog reset occurred (read). bit 1 = wdge watchdog enable this bit is set and cleared by software. 0: watchdog disabled 1: watchdog enabled bit 0 = wdgd watchdog reset delay this bit is set by software. it is cleared by hard- ware at the end of each t wdg period. 0: watchdog reset not delayed 1: watchdog reset delayed lite timer input capture register (lticr) read only reset value: 0000 0000 (00h) bit 7:0 = icr[7:0] input capture value these bits are read by software and cleared by hardware after a reset. if the icf bit in the ltcsr is cleared, the value of t he 8-bit up-counter will be captured when a rising or falling edge occurs on the ltic pin. table 13. lite timer register map and reset values 70 icie icf tb tbie tbf wdgr wdge wdgd 70 icr7 icr6 icr5 icr4 icr3 icr2 icr1 icr0 address (hex.) register label 76543210 0b ltcsr reset value icie 0 icf x tb 0 tbie 0 tbf 0 wdgrf 0 wdge 0 wdgd 0 0c lticr reset value icr7 0 icr6 0 icr5 0 icr4 0 icr3 0 icr2 0 icr1 0 icr0 0 1
st7lite0xy0, st7litesxy0 53/124 11.2 12-bit autoreload timer (at) 11.2.1 introduction the 12-bit autoreload timer can be used for gen- eral-purpose timing functions. it is based on a free- running 12-bit upcounter with a pwm output chan- nel. 11.2.2 main features 12-bit upcounter with 12-bit autoreload register (atr) maskable overflow interrupt pwm signal generator frequency range 2khz-4mhz (@ 8 mhz f cpu ) ? programmable duty-cycle ? polarity control ? maskable compare interrupt output compare function figure 34. block diagram atcsr cmpie ovfie ovf ck0 ck1 0 0 0 12-bit autoreload value 12-bit upcounter cmpf0 bit cmpf0 cmp interrupt request ovf interrupt request f cpu atr pwm generation pol- arity op0 bit pwm0 comp- pare f counter f pwm output control oe0 bit cntr (1 ms timebase f ltimer dcr0h dcr0l update on ovf event preload preload @ 8mhz) 70 on ovf event 0 1 12-bit duty cycle value (shadow) oe0 bit if oe0=1 1
st7lite0xy0, st7litesxy0 54/124 12-bit autoreload timer (cont?d) 11.2.3 functional description pwm mode this mode allows a pulse width modulated sig- nals to be generated on the pwm0 output pin with minimum core processing overhead. the pwm0 output signal can be enabled or disabled using the oe0 bit in the pwmcr register. when this bit is set the pwm i/o pin is configured as output push- pull alternate function. note: cmpf0 is available in pwm mode (see pwm0csr description on page 57 ). pwm frequency and duty cycle the pwm signal frequency (f pwm ) is controlled by the counter period and the atr register value. f pwm = f counter / (4096 - atr) following the above formula, if f cpu is 8 mhz, the maximum value of f pwm is 4 mhz (atr register value = 4094), and the minimum value is 2 khz (atr register value = 0). note: the maximum value of atr is 4094 be- cause it must be lower than the dcr value which must be 4095 in this case. at reset, the counter starts counting from 0. software must wr ite the duty cycle value in the dcr0h and dcr0l preload registers. the dcr0h register must be written first. see caution below. when a upcounter overflow occurs (ovf event), the atr value is loaded in the upcounter, the preloaded duty cycle value is transferred to the duty cycle register and the pwm0 signal is set to a high level. when the upcounter matches the dcrx value the pwm0 signals is set to a low level. to obtain a signal on the pwm0 pin, the contents of the dcr0 register must be greater than the con- tents of the atr register. the polarity bit can be used to invert the output signal. the maximum available resolution for the pwm0 duty cycle is: resolution = 1 / (4096 - atr) note : to get the maximum resolution (1/4096), the atr register must be 0. with this maximum reso- lution and assuming that dcr=atr, a 0% or 100% duty cycle can be obtained by changing the polarity . caution: as soon as the dcr0h is written, the compare function is disabled and will start only when the dcr0l value is written. if the dcr0h write occurs just before the compare event, the signal on the pwm output may not be set to a low level. in this case, the dc rx register should be up- dated just after an ovf event. if the dcr and atr values are close, then th e dcrx register shouldbe updated just before an ovf event, in order not to miss a compare event and to have the right signal applied on the pwm output. figure 35. pwm function duty cycle register auto-reload register pwm0 output t 4095 000 with oe0=1 and op0=0 (atr) (dcr0) with oe0=1 and op0=1 counter 1
st7lite0xy0, st7litesxy0 55/124 12-bit autoreload timer (cont?d) figure 36. pwm signal example output compare mode to use this function, the oe bit must be 0, other- wise the compare is done with the shadow register instead of the dcrx register. software must then write a 12-bit value in the dcr0h and dcr0l reg- isters. this value will be loaded immediately (with- out waiting for an ovf event). the dcr0h must be written first, the output com- pare function starts only when the dcr0l value is written. when the 12-bit upcounter (cntr) reaches the value stored in the dcr0h and dcr0l registers, the cmpf0 bit in the pwm0csr register is set and an interrupt request is generated if the cmpie bit is set. note: the output compare function is only availa- ble for dcrx values other than 0 (reset value). caution: at each ovf event, the dcrx value is written in a shadow register, even if the dcr0l value has not yet been written (in this case, the shadow register will contain the new dcr0h value and the old dcr0l value), then: ? if oe=1 (pwm mode): the compare is done be- tween the timer counter and the shadow register (and not dcrx) ? if oe=0 (ocmp mode): the compare is done be- tween the timer counter and dcrx. there is no pwm signal. the compare between dcrx or the shadow regis- ter and the timer counter is locked until dcr0l is written. 11.2.4 low power modes 11.2.5 interrupts notes: 1. the interrupt events are connected to separate interrupt vectors (see interrupts chapter). they generate an interrupt if the enable bit is set in the atcsr register and the interrupt mask in the cc register is reset (rim instruction). 2. only if ck0=1and ck1=0 counter pwm0 output t with oe0=1 and op0=0 ffdh ffeh fffh ffdh ffeh fffh ffdh ffeh dcr0=ffeh atr= ffdh f counter mode description slow the input frequency is divided by 32 wait no effect on at timer active-halt at timer halted except if ck0=1, ck1=0 and ovfie=1 halt at timer halted interrupt event 1) event flag enable control bit exit from wait exit from halt exit from active- halt overflow event ovf ovfie yes no yes 2) cmp event cmpfx cmpie yes no no 1
st7lite0xy0, st7litesxy0 56/124 12-bit autoreload timer (cont?d) 11.2.6 register description timer control status register (atc- sr) read / write reset value: 0000 0000 (00h) bit 7:5 = reserved, must be kept cleared. bit 4:3 = ck[1:0] counter clock selection. these bits are set and cleared by software and cleared by hardware after a reset. they select the clock frequency of the counter. bit 2 = ovf overflow flag. this bit is set by hardware and cleared by software by reading the atcsr register. it indicates the transition of the counter from fffh to atr value. 0: no counter overflow occurred 1: counter overflow occurred caution: when set, the ovf bit stays high for 1 f counter cycle, (up to 1ms depending on the clock selec- tion). bit 1 = ovfie overflow interrupt enable. this bit is read/write by software and cleared by hardware after a reset. 0: ovf interrupt disabled 1: ovf interrupt enabled bit 0 = cmpie compare interrupt enable . this bit is read/write by software and clear by hardware after a reset. it allows to mask the inter- rupt generation when cmpf bit is set. 0: cmpf interrupt disabled 1: cmpf interrupt enabled counter register high (cntrh) read only reset value: 0000 0000 (00h) counter register low (cntrl) read only reset value: 0000 0000 (00h) bits 15:12 = reserved, must be kept cleared. bits 11:0 = cntr[11:0] counter value . this 12-bit register is read by software and cleared by hardware after a reset. the counter is incre- mented continuously as soon as a counter clock is selected. to obtain the 12-bit value, software should read the counter value in two consecutive read operations. the cntrh register can be in- cremented between the two reads, and in order to be accurate when f timer =f cpu , the software should take this into account when cntrl and cntrh are read. if cntrl is close to its highest value, cntrh could be incremented before it is read. when a counter overflow occurs, the counter re- starts from the value specified in the atr register. 70 0 0 0 ck1 ck0 ovf ovfie cmpie counter clock selection ck1 ck0 off 0 0 f ltimer (1 ms timebase @ 8 mhz) 0 1 f cpu 10 reserved 1 1 15 8 0 0 0 0 cn11 cn10 cn9 cn8 70 cn7 cn6 cn5 cn4 cn3 cn2 cn1 cn0 1
st7lite0xy0, st7litesxy0 57/124 12-bit autoreload timer (cont?d) auto reload register (atrh) read / write reset value: 0000 0000 (00h) auto reload register (atrl) read / write reset value: 0000 0000 (00h) bits 15:12 = reserved, must be kept cleared. bits 11:0 = atr[11:0] autoreload register. this is a 12-bit register which is written by soft- ware. the atr register value is automatically loaded into the upcounter when an overflow oc- curs. the register value is used to set the pwm frequency. pwm0 duty cycle register high (dcr0h) read / write reset value: 0000 0000 (00h) pwm0 duty cycle register low (dcr0l) read / write reset value: 0000 0000 (00h) bits 15:12 = reserved, must be kept cleared. bits 11:0 = dcr[11:0] pwmx duty cycle value this 12-bit value is written by software. the high register must be written first. in pwm mode (oe0=1 in the pwmcr register) the dcr[11:0] bits define the duty cycle of the pwm0 output signal (see figure 35 ). in output compare mode, (oe0=0 in the pwmcr register) they define the value to be compared with the 12- bit upcounter value. pwm0 control/status register (pwm0csr) read / write reset value: 0000 0000 (00h) bit 7:2= reserved, must be kept cleared. bit 1 = op0 pwm0 output polarity. this bit is read/write by software and cleared by hardware after a reset. this bit selects the polarity of the pwm0 signal. 0: the pwm0 signal is not inverted. 1: the pwm0 signal is inverted. bit 0 = cmpf0 pwm0 compare flag. this bit is set by hardware and cleared by software by reading the pwm0csr register. it indicates that the upcounter value matches the dcr0 regis- ter value. 0: upcounter value does not match dcr value. 1: upcounter value matches dcr value. 15 8 0 0 0 0 atr11 atr10 atr9 atr8 70 atr7 atr6 atr5 atr4 atr3 atr2 atr1 atr0 15 8 0 0 0 0 dcr11 dcr10 dcr9 dcr8 70 dcr7 dcr6 dcr5 dcr4 dcr3 dcr2 dcr1 dcr0 70 000000op0cmpf0 1
st7lite0xy0, st7litesxy0 58/124 12-bit autoreload timer (cont?d) pwm output control register (pwmcr) read/write reset value: 0000 0000 (00h) bits 7:1 = reserved, mu st be kept cleared. bit 0 = oe0 pwm0 output enable . this bit is set and cleared by software. 0: pwm0 output alternate function disabled (i/o pin free for general purpose i/o) 1: pwm0 output enabled table 14. register map and reset values 70 0000000oe0 address (hex.) register label 76543210 0d atcsr reset value 000 ck1 0 ck0 0 ovf 0 ovfie 0 cmpie 0 0e cntrh reset value 0000 cn11 0 cn10 0 cn9 0 cn8 0 0f cntrl reset value cn7 0 cn6 0 cn5 0 cn4 0 cn3 0 cn2 0 cn1 0 cn0 0 10 atrh reset value 0000 atr11 0 atr10 0 atr9 0 atr8 0 11 atrl reset value atr7 0 atr6 0 atr5 0 atr4 0 atr3 0 atr2 0 atr1 0 atr0 0 12 pwmcr reset value 0000000 oe0 0 13 pwm0csr reset value 000000 op 0 cmpf0 0 17 dcr0h reset value 0000 dcr11 0 dcr10 0 dcr9 0 dcr8 0 18 dcr0l reset value dcr7 0 dcr6 0 dcr5 0 dcr4 0 dcr3 0 dcr2 0 dcr1 0 dcr0 0 1
st7lite0xy0, st7litesxy0 59/124 11.3 serial peripheral interface (spi) 11.3.1 introduction the serial peripheral interface (spi) allows full- duplex, synchronous, serial communication with external devices. an spi system may consist of a master and one or more slaves however the spi interface can not be a master in a multi-master system. 11.3.2 main features full duplex synchronous transfers (on 3 lines) simplex synchronous transfers (on 2 lines) master or slave operation six master mode frequencies (f cpu /4 max.) f cpu /2 max. slave mode frequency (see note) ss management by software or hardware programmable clock polarity and phase end of transfer interrupt flag write collision, master mode fault and overrun flags note: in slave mode, continuous transmission is not possible at maximum frequency due to the software overhead for clearing status flags and to initiate the next transmission sequence. 11.3.3 general description figure 37 shows the serial peripheral interface (spi) block diagram. there are 3 registers: ? spi control register (spicr) ? spi control/status register (spicsr) ? spi data register (spidr) the spi is connected to external devices through 3 pins: ? miso: master in / slave out data ? mosi: master out / slave in data ? sck: serial clock out by spi masters and in- put by spi slaves ?ss : slave select: this input signal acts as a ?chip select? to let the spi master communicate with slaves indi- vidually and to avoid contention on the data lines. slave ss inputs can be driven by stand- ard i/o ports on the master mcu. figure 37. serial peripheral interface block diagram spidr read buffer 8-bit shift register write read data/address bus spi spie spe mstr cpha spr0 spr1 cpol serial clock generator mosi miso ss sck control state spicr spicsr interrupt request master control spr2 0 7 0 7 spif wcol modf 0 ovr ssi ssm sod sod bit ss 1 0 1
st7lite0xy0, st7litesxy0 60/124 serial peripheral interface (cont?d) 11.3.3.1 functional description a basic example of inte rconnections between a single master and a sing le slave is illustrated in figure 38 . the mosi pins are connected together and the miso pins are connected together. in this way data is transferred serially between master and slave (most significant bit first). the communication is alwa ys initiated by the mas- ter. when the master device transmits data to a slave device via mosi pin, the slave device re- sponds by sending data to the master device via the miso pin. this imp lies full duplex communica- tion with both data out and data in synchronized with the same clock signal (which is provided by the master device via the sck pin). to use a single data line, the miso and mosi pins must be connected at each node (in this case only simplex communication is possible). four possible data/clock timing relationships may be chosen (see figure 41 ) but master and slave must be programmed with the same timing mode. figure 38. single master/ single slave application 8-bit shift register spi clock generator 8-bit shift register miso mosi mosi miso sck sck slave master ss ss +5v msbit lsbit msbit lsbit not used if ss is managed by software 1
st7lite0xy0, st7litesxy0 61/124 serial peripheral interface (cont?d) 11.3.3.2 slave select management as an alternative to using the ss pin to control the slave select signal, the application can choose to manage the slave select signal by software. this is configured by the ssm bit in the spicsr regis- ter (see figure 40 ) in software management, the external ss pin is free for other application uses and the internal ss signal level is driven by writing to the ssi bit in the spicsr register. in master mode: ?ss internal must be held high continuously in slave mode: there are two cases depending on the data/clock timing relationship (see figure 39 ): if cpha=1 (data latched on 2nd clock edge): ?ss internal must be held low during the entire transmission. this implies that in single slave applications the ss pin either can be tied to v ss , or made free for standard i/o by manag- ing the ss function by software (ssm= 1 and ssi=0 in the in the spicsr register) if cpha=0 (data latched on 1st clock edge): ?ss internal must be held low during byte transmission and pulled high between each byte to allow the slave to write to the shift reg- ister. if ss is not pulled high, a write collision error will occur when the slave writes to the shift register (see section 11.3.5.3 ). figure 39. generic ss timing diagram figure 40. hardware/software slave select management mosi/miso master ss slave ss (if cpha=0) slave ss (if cpha=1) byte 1 byte 2 byte 3 1 0 ss internal ssm bit ssi bit ss external pin 1
st7lite0xy0, st7litesxy0 62/124 serial peripheral interface (cont?d) 11.3.3.3 master mode operation in master mode, the serial clock is output on the sck pin. the clock frequency, polarity and phase are configured by software (refer to the description of the spicsr register). note: the idle state of sck must correspond to the polarity selected in the spicsr register (by pulling up sck if cpol=1 or pulling down sck if cpol=0). how to operate the spi in master mode to operate the spi in master mode, perform the following steps in order: 1. write to the spicr register: ? select the clock frequency by configuring the spr[2:0] bits. ? select the clock polarity and clock phase by configuring the cpol and cpha bits. figure 41 shows the four possible configurations. note: the slave must have the same cpol and cpha settings as the master. 2. write to the spicsr register: ? either set the ssm bit and set the ssi bit or clear the ssm bit and tie the ss pin high for the complete byte transmit sequence. 3. write to the spicr register: ? set the mstr and spe bits note: mstr and spe bits remain set only if ss is high. important note: if the spicsr regi ster is not writ- ten first, the spicr register setting (mstr bit) may be not taken into account. the transmit sequence begins when software writes a byte in the spidr register. 11.3.3.4 master mode transmit sequence when software writes to the spidr register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the mosi pin most sig- nificant bit first. when data transfer is complete: ? the spif bit is set by hardware ? an interrupt request is generated if the spie bit is set and the interrupt mask in the ccr register is cleared. clearing the spif bit is performed by the following software sequence: 1. an access to the spicsr register while the spif bit is set 2. a read to the spidr register. note: while the spif bit is se t, all writes to the spidr register are inhibited until the spicsr reg- ister is read. 11.3.3.5 slave mode operation in slave mode, the serial clock is received on the sck pin from the master device. to operate the spi in slave mode: 1. write to the spicsr register to perform the fol- lowing actions: ? select the clock polarity and clock phase by configuring the cpol and cpha bits (see figure 41 ). note: the slave must have the same cpol and cpha settings as the master. ? manage the ss pin as described in section 11.3.3.2 and figure 39 . if cpha=1 ss must be held low continuously. if cpha=0 ss must be held low during byte transmission and pulled up between each byte to let the slave write in the shift register. 2. write to the spicr register to clear the mstr bit and set the spe bit to enable the spi i/o functions. 11.3.3.6 slave mode transmit sequence when software writes to the spidr register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the miso pin most sig- nificant bit first. the transmit sequence begins when the slave de- vice receives the clock signal and the most signifi- cant bit of the data on its mosi pin. when data transfer is complete: ? the spif bit is set by hardware ? an interrupt request is generated if spie bit is set and interrupt mask in the ccr register is cleared. clearing the spif bit is performed by the following software sequence: 1. an access to the spics r register while the spif bit is set. 2. a write or a read to the spidr register. notes: while the spif bit is set, all writes to the spidr register are inhibited until the spicsr reg- ister is read. the spif bit can be cleared during a second transmission; however, it must be cleared before the second spif bit in order to prevent an overrun condition (see section 11.3.5.2 ). 1
st7lite0xy0, st7litesxy0 63/124 serial peripheral interface (cont?d) 11.3.4 clock phase and clock polarity four possible timing relationships may be chosen by software, using the cpol and cpha bits (see figure 41 ). note: the idle state of sck must correspond to the polarity selected in the spicsr register (by pulling up sck if cpol=1 or pulling down sck if cpol=0). the combination of the cpol clock polarity and cpha (clock phase) bits selects the data capture clock edge figure 41 , shows an spi transfer with the four combinations of the cpha and cpol bits. the di- agram may be interpreted as a master or slave timing diagram where the sck pin, the miso pin, the mosi pin are directly connected between the master and the slave device. note : if cpol is changed at the communication byte boundaries, the spi must be disabled by re- setting the spe bit. figure 41. data clock timing diagram sck msbit bit 6 bit 5 bit 4 bit3 bit 2 bit 1 lsbit msbit bit 6 bit 5 bit 4 bit3bit 2bit 1lsbit miso (from master) mosi (from slave) ss (to slave) capture strobe cpha =1 msbit bit 6 bit 5 bit 4 bit3 bit 2 bit 1 lsbit msbit bit 6 bit 5 bit 4 bit3 bit 2 bit 1 lsbit miso (from master) mosi ss (to slave) capture strobe cpha =0 note: this figure should not be used as a replacement for parametric information. refer to the electrical characteristics chapter. (from slave) (cpol = 1) sck (cpol = 0) sck (cpol = 1) sck (cpol = 0) 1
st7lite0xy0, st7litesxy0 64/124 serial peripheral interface (cont?d) 11.3.5 error flags 11.3.5.1 master mode fault (modf) master mode fault occurs when the master device has its ss pin pulled low. when a master mode fault occurs: ? the modf bit is set and an spi interrupt re- quest is generated if the spie bit is set. ? the spe bit is reset. this blocks all output from the device and disables the spi periph- eral. ? the mstr bit is reset, thus forcing the device into slave mode. clearing the modf bit is done through a software sequence: 1. a read access to the spicsr register while the modf bit is set. 2. a write to the spicr register. notes: to avoid any conflicts in an application with multiple slaves, the ss pin must be pulled high during the modf bit clearing sequence. the spe and mstr bits may be restored to their orig- inal state during or after this clearing sequence. hardware does not allow the user to set the spe and mstr bits while the modf bit is set except in the modf bit clearing sequence. 11.3.5.2 overrun condition (ovr) an overrun condition occurs, when the master de- vice has sent a data byte and the slave device has not cleared the spif bit issued from the previously transmitted byte. when an overrun occurs: ? the ovr bit is set and an interrupt request is generated if the spie bit is set. in this case, the receiver buffer contains the byte sent after the spif bit was last cleared. a read to the spidr register returns this byte. all other bytes are lost. the ovr bit is cleared by reading the spicsr register. 11.3.5.3 write collision error (wcol) a write collision occurs when the software tries to write to the spidr register while a data transfer is taking place with an external device. when this happens, the transfer continues uninterrupted; and the software write will be unsuccessful. write collisions can occur both in master and slave mode. see also section 11.3.3.2 slave select management . note: a "read collision" will never occur since the received data byte is placed in a buffer in which access is always synchronous with the mcu oper- ation. the wcol bit in the spicsr register is set if a write collision occurs. no spi interrupt is generated when the wcol bit is set (the wcol bit is a status flag only). clearing the wcol bit is done through a software sequence (see figure 42 ). figure 42. clearing the wcol bit (write collision flag) software sequence clearing sequence after spif = 1 (end of a data byte transfer) 1st step read spicsr read spidr 2nd step spif =0 wcol=0 clearing sequence before spif = 1 (during a data byte transfer) 1st step 2nd step wcol=0 read spicsr read spidr note: writing to the spidr regis- ter instead of reading it does not reset the wcol bit result result 1
st7lite0xy0, st7litesxy0 65/124 serial peripheral interface (cont?d) 11.3.5.4 single master systems a typical single master system may be configured, using an mcu as the master and four mcus as slaves (see figure 43 ). the master device selects the individual slave de- vices by using four pins of a parallel port to control the four ss pins of the slave devices. the ss pins are pulled high during reset since the master device ports will be forced to be inputs at that time, thus disabling the slave devices. note: to prevent a bus conflict on the miso line the master allows only one active slave device during a transmission. for more security, the slave device may respond to the master with the received data byte. then the master will receive the previo us byte back from the slave device if all miso and mosi pins are con- nected and the slave has not written to its spidr register. other transmission security methods can use ports for handshake lines or data bytes with com- mand fields. figure 43. single master / multiple slave configuration miso mosi mosi mosi mosi mosi miso miso miso miso ss ss ss ss ss sck sck sck sck sck 5v ports slave mcu slave mcu slave mcu slave mcu master mcu 1
st7lite0xy0, st7litesxy0 66/124 serial peripheral interface (cont?d) 11.3.6 low power modes 11.3.6.1 using the spi to wakeup the mcu from halt mode in slave configuration, the spi is able to wakeup the st7 device from halt mode through a spif interrupt. the data received is subsequently read from the spidr register when the software is run- ning (interrupt vector fetch). if multiple data trans- fers have been performed before software clears the spif bit, then the ovr bit is set by hardware. note: when waking up from halt mode, if the spi remains in slave mode, it is recommended to per- form an extra communications cycle to bring the spi from halt mode state to normal state. if the spi exits from slave mode, it returns to normal state immediately. caution: the spi can wake up the st7 from halt mode only if the slave select signal (external ss pin or the ssi bit in the spicsr register) is low when the st7 enters halt mode. so if slave selec- tion is configured as external (see section 11.3.3.2 ), make sure the master drives a low level on the ss pin when the slave enters halt mode. 11.3.7 interrupts note : the spi interrupt events are connected to the same interrupt vector (see interrupts chapter). they generate an interrupt if the corresponding enable control bit is set and the interrupt mask in the cc register is reset (rim instruction). mode description wait no effect on spi. spi interrupt events cause the device to exit from wait mode. halt spi registers are frozen. in halt mode, the spi is inactive. spi oper- ation resumes when the mcu is woken up by an interrupt with ?exit from halt mode? ca- pability. the data received is subsequently read from the spidr r egister when the soft- ware is running (interrupt vector fetching). if several data are received before the wake- up event, then an overru n error is generated. this error can be detected after the fetch of the interrupt routine t hat woke up the device. interrupt event event flag enable control bit exit from wait exit from halt spi end of trans- fer event spif spie yes yes master mode fault event modf yes no overrun error ovr yes no 1
st7lite0xy0, st7litesxy0 67/124 serial peripheral interface (cont?d) 11.3.8 register description control register (spicr) read/write reset value: 0000 xxxx (0xh) bit 7 = spie serial peripheral interrupt enable. this bit is set and cleared by software. 0: interrupt is inhibited 1: an spi interrupt is generated whenever spif=1, modf=1 or ovr=1 in the spicsr register bit 6 = spe serial peripheral output enable. this bit is set and cleared by software. it is also cleared by hardware when, in master mode, ss =0 (see section 11.3.5.1 master mode fault (modf) ). the spe bit is cleared by reset, so the spi peripheral is not initia lly connected to the ex- ternal pins. 0: i/o pins free for general purpose i/o 1: spi i/o pin alternate functions enabled bit 5 = spr2 divider enable . this bit is set and cleared by software and is cleared by reset. it is used with the spr[1:0] bits to set the baud rate. refer to table 15 spi master mode sck frequency . 0: divider by 2 enabled 1: divider by 2 disabled note: this bit has no effect in slave mode. bit 4 = mstr master mode. this bit is set and cleared by software. it is also cleared by hardware when, in master mode, ss =0 (see section 11.3.5.1 master mode fault (modf) ). 0: slave mode 1: master mode. the function of the sck pin changes from an input to an output and the func- tions of the miso and mosi pins are reversed. bit 3 = cpol clock polarity. this bit is set and cleared by software. this bit de- termines the idle state of the serial clock. the cpol bit affects both the master and slave modes. 0: sck pin has a low level idle state 1: sck pin has a high level idle state note : if cpol is changed at the communication byte boundaries, the spi must be disabled by re- setting the spe bit. bit 2 = cpha clock phase. this bit is set and cleared by software. 0: the first clock transition is the first data capture edge. 1: the second clock transition is the first capture edge. note: the slave must have the same cpol and cpha settings as the master. bits 1:0 = spr[1:0] serial clock frequency. these bits are set and cleared by software. used with the spr2 bit, they select the baud rate of the spi serial clock sck output by the spi in master mode. note: these 2 bits have no effect in slave mode. table 15. spi master mode sck frequency 70 spie spe spr2 mstr cpol cpha spr1 spr0 serial clock spr2 spr1 spr0 f cpu /4 1 0 0 f cpu /8 0 0 0 f cpu /16 0 0 1 f cpu /32 1 1 0 f cpu /64 0 1 0 f cpu /128 0 1 1 1
st7lite0xy0, st7litesxy0 68/124 serial peripheral interface (cont?d) control/status register (spicsr) read/write (some bits read only) reset value: 0000 0000 (00h) bit 7 = spif serial peripheral data transfer flag (read only). this bit is set by hardware when a transfer has been completed. an interrupt is generated if spie=1 in the spicr regist er. it is cleared by a software sequence (an access to the spicsr register followed by a write or a read to the spidr register). 0: data transfer is in progress or the flag has been cleared. 1: data transfer between the device and an exter- nal device has been completed. note: while the spif bit is se t, all writes to the spidr register are inhibited until the spicsr reg- ister is read. bit 6 = wcol write collision stat us (read only). this bit is set by hardware when a write to the spidr register is done during a transmit se- quence. it is cleared by a software sequence (see figure 42 ). 0: no write collision occurred 1: a write collision has been detected bit 5 = ovr s pi overrun error (read only). this bit is set by hardware when the byte currently being received in the shift register is ready to be transferred into the spidr register while spif = 1 (see section 11.3.5.2 ). an interrupt is generated if spie = 1 in the spicr register. the ovr bit is cleared by software reading the spicsr register. 0: no overrun error 1: overrun error detected bit 4 = modf mode fault flag (read only). this bit is set by hardware when the ss pin is pulled low in master mode (see section 11.3.5.1 master mode fault (modf) ). an spi interrupt can be generated if spie=1 in the spicr register. this bit is cleared by a software sequence (an access to the spicsr register while modf=1 followed by a write to the spicr register). 0: no master mode fault detected 1: a fault in master mode has been detected bit 3 = reserved, must be kept cleared. bit 2 = sod spi output disable. this bit is set and cleared by software. when set, it disables the alternate function of the spi output (mosi in master mode / miso in slave mode) 0: spi output enabled (if spe=1) 1: spi output disabled bit 1 = ssm ss management. this bit is set and cleared by software. when set, it disables the alternate function of the spi ss pin and uses the ssi bit value instead. see section 11.3.3.2 slave select management . 0: hardware management (ss managed by exter- nal pin) 1: software management (internal ss signal con- trolled by ssi bit. external ss pin free for gener- al-purpose i/o) bit 0 = ssi ss internal mode. this bit is set and cleared by software. it acts as a ?chip select? by controlling the level of the ss slave select signal when the ssm bit is set. 0 : slave selected 1 : slave deselected data i/o register (spidr) read/write reset value: undefined the spidr register is used to transmit and receive data on the serial bus. in a master device, a write to this register will init iate transmission/reception of another byte. notes: during the last clock cycle the spif bit is set, a copy of the received data byte in the shift register is moved to a buffer. when the user reads the serial peripheral data i/o register, the buffer is actually being read. while the spif bit is set, all writes to the spidr register are inhibited until the spicsr register is read. warning: a write to the spidr register places data directly into the shift register for transmission. a read to the spidr register returns the value lo- cated in the buffer and not the content of the shift register (see figure 37 ). 70 spif wcol ovr modf - sod ssm ssi 70 d7 d6 d5 d4 d3 d2 d1 d0 1
st7lite0xy0, st7litesxy0 69/124 serial peripheral interface (cont?d) table 16. spi register map and reset values address (hex.) register label 76543210 31 spidr reset value msb xxxxxxx lsb x 32 spicr reset value spie 0 spe 0 spr2 0 mstr 0 cpol x cpha x spr1 x spr0 x 33 spicsr reset value spif 0 wcol 0 ovr 0 modf 00 sod 0 ssm 0 ssi 0 1
st7lite0xy0, st7litesxy0 70/124 11.4 8-bit a/d converter (adc) 11.4.1 introduction the on-chip analog to digital converter (adc) pe- ripheral is a 8-bit, succ essive approximation con- verter with internal sample and hold circuitry. this peripheral has up to 5 multiplexed analog input channels (refer to device pin out description) that allow the peripheral to convert the analog voltage levels from up to 5 different sources. the result of the conversion is stored in a 8-bit data register. the a/d converter is controlled through a control/status register. 11.4.2 main features 8-bit conversion up to 5 channels with multiplexed input linear successive approximation dual input range ?0 to v dd or ? 0v to 250mv data register (dr) which contains the results conversion complete status flag on/off bit (to reduce consumption) fixed gain operational amplifier (x8) (not available on st7lites5 devices) 11.4.3 functional description 11.4.3.1 analog power supply the block diagram is shown in figure 44 . v dd and v ss are the high and low level reference voltage pins. conversion accuracy may therefore be impacted by voltage drops and noise in the event of heavily loaded or badly decoupled power supply lines. for more details, refer to the electrical character- istics section. 11.4.3.2 input voltage amplifier the input voltage can be amplified by a factor of 8 by enabling the ampsel bit in the adamp regis- ter. when the amplifier is enabled, the input range is 0v to 250 mv. for example, if v dd = 5v, then the adc can con- vert voltages in the range 0v to 250mv with an ideal resolution of 2.4mv (equivalent to 11-bit res- olution with reference to a v ss to v dd range). for more details, refer to the electrical character- istics section. note: the amplifier is switched on by the adon bit in the adccsr register, so no additional start- up time is required when the amplifier is selected by the ampsel bit. 1
st7lite0xy0, st7litesxy0 71/124 figure 44. adc block diagram ch2 ch1 0 eoc speed adon 0 ch0 adccsr ain0 ain1 analog to digital converter ainx analog mux r adc c adc d2 d1 d3 d7 d6 d5 d4 d0 adcdr 3 f adc hold control x 1 or x 8 ampsel bit (adcamp register) f cpu 0 1 1 0 div 2 div 4 slow bit (adcamp register) 7 0 1
st7lite0xy0, st7litesxy0 72/124 8-bit a/d converter (adc) (cont?d) 11.4.3.3 digital a/d conversion result the conversion is monotonic, meaning that the re- sult never decreases if the analog input does not and never increases if the analog input does not. if the input voltage (v ain ) is greater than or equal to v dda (high-level voltage reference) then the conversion result in the dr register is ffh (full scale) without overflow indication. if input voltage (v ain ) is lower than or equal to v ssa (low-level voltage reference) then the con- version result in the dr register is 00h. the a/d converter is linear and the digital result of the conversion is stored in the adcdr register. the accuracy of the conversion is described in the parametric section. r ain is the maximum recommended impedance for an analog input signal. if the impedance is too high, this will result in a loss of accuracy due to leakage and sampling not being completed in the alloted time. 11.4.3.4 a/d conversion phases the a/d conversion is based on two conversion phases as shown in figure 45 : sample capacitor loading [duration: t sample ] during this phase, the v ain input voltage to be measured is loaded into the c adc sample capacitor. a/d conversion [duration: t hold ] during this phase, the a/d conversion is computed (8 successive approximations cycles) and the c adc sample capacitor is disconnected from the analog input pin to get the optimum analog to digital conversion accuracy. the total conversion time: t conv = t sample + t hold while the adc is on, thes e two phases are contin- uously repeated. at the end of each conversion, the sample capaci- tor is kept loaded with the previous measurement load. the advantage of this behaviour is that it minimizes the current consumption on the analog pin in case of single input channel measurement. 11.4.3.5 software procedure refer to the control/status register (csr) and data register (dr) in section 11.4.6 for the bit defini- tions and to figure 45 for the timings. adc configuration the analog input ports must be configured as in- put, no pull-up, no interrupt. refer to the ?i/o ports? chapter. using these pins as analog inputs does not affect the ability of the port to be read as a logic input. in the csr register: ? select the ch[2:0] bits to assign the analog channel to be converted. adc conversion in the csr register: ? set the adon bit to enable the a/d converter and to start the first conversion. from this time on, the adc performs a continuous conver- sion of the selected channel. when a conversion is complete ? the eoc bit is set by hardware. ? no interrupt is generated. ? the result is in the dr register and remains valid until the next conversion has ended. a write to the adccsr register (with adon set) aborts the current conversion, resets the eoc bit and starts a new conversion. figure 45. adc conversion timings 11.4.4 low power modes note : the a/d converter may be disabled by reset- ting the adon bit. this feature allows reduced power consumption when no conversion is needed and between single shot conversions. 11.4.5 interrupts none mode description wait no effect on a/d converter halt a/d converter disabled. after wakeup from halt mode, the a/d con- verter requires a stabilization time before ac- curate conversions can be performed. adccsr write adon eoc bit set t sample t hold operation hold control t conv 1
st7lite0xy0, st7litesxy0 73/124 8-bit a/d converter (adc) (cont?d) 11.4.6 register description control/status register (adccsr) read/write reset value: 0000 0000 (00h) bit 7 = eoc conversion complete this bit is set by hardware. it is cleared by soft- ware reading the result in the dr register or writing to the csr register. 0: conversion is not complete 1: conversion can be read from the dr register bit 6 = speed adc clock selection this bit is set and cleared by software. it is used together with the slow bit to configure the adc clock speed. refer to the table in the slow bit de- scription. bit 5 = adon a/d converter and amplifier on this bit is set and cleared by software. 0: a/d converter and amplifier are switched off 1: a/d converter and amplifier are switched on note : amplifier not ava ilable on st7lites5 devices bits 4:3 = reserved. must always be cleared. bits 2:0 = ch[2:0] channel selection these bits are set and cleared by software. they select the analog input to convert. notes : 1. the number of pins and the channel selection varies according to the device. refer to the device pinout. 2. a write to the adccsr register (with adon set) aborts the current conversion, resets the eoc bit and starts a new conversion. data register (adcdr) read only reset value: 0000 0000 (00h) bits 7:0 = d[7:0] analog converted value this register contains the converted analog value in the range 00h to ffh. note : reading this register reset the eoc flag. amplifier control register (adcamp) read/write reset value: 0000 0000 (00h) bit 7:4 = reserved. forced by hardware to 0. bit 3 = slow slow mode this bit is set and cleared by software. it is used together with the speed bi t to configure the adc clock speed as shown on the table below. bit 2 = ampsel amplifier selection bit this bit is set and cleared by software. for st7lites5 devices, this bit must be kept at its re- set value (0). 0: amplifier is not selected 1: amplifier is selected note: when ampsel=1 it is mandatory that f adc be less than or equal to 2 mhz. bits 1:0 = reserved. forced by hardware to 0. note : if adc settings are changed by writing the adcamp register while the adc is running, a dummy conversion is needed before obtaining re- sults with the new settings. 70 eoc speed adon 0 0 ch2 ch1 ch0 channel pin 1 ch2 ch1 ch0 ain0 0 0 0 ain1 0 0 1 ain2 0 1 0 ain3 0 1 1 ain4 1 0 0 70 d7 d6 d5 d4 d3 d2 d1 d0 70 0000slow amp- sel 00 f adc slow speed f cpu /2 00 f cpu 01 f cpu /4 1x 1
st7lite0xy0, st7litesxy0 74/124 table 17. adc register map and reset values address (hex.) register label 76543210 34h adccsr reset value eoc 0 speed 0 adon 000 ch2 0 ch1 0 ch0 0 35h adcdr reset value d7 0 d6 0 d5 0 d4 0 d3 0 d2 0 d1 0 d0 0 36h adcamp reset value 0000 slow 0 ampsel 0 00 1
st7lite0xy0, st7litesxy0 75/124 12 instruction set 12.1 st7 addressing modes the st7 core features 17 different addressing modes which can be cla ssified in seven main groups: the st7 instruction set is designed to minimize the number of bytes required per instruction: to do so, most of the addressing modes may be subdi- vided in two submodes called long and short: ? long addressing mode is more powerful be- cause it can use the full 64 kbyte address space, however it uses more bytes and more cpu cy- cles. ? short addressing mode is less powerful because it can generally only access page zero (0000h - 00ffh range), but the instruction size is more compact, and faster. all memory to memory in- structions use short addressing modes only (clr, cpl, neg, bset, bres, btjt, btjf, inc, dec, rlc, rrc, sll, srl, sra, swap) the st7 assembler optimizes the use of long and short addressing modes. table 18. st7 addressing mode overview note : 1. at the time the instruction is ex ecuted, the program counter (pc) point s to the instruction following jrxx. addressing mode example inherent nop immediate ld a,#$55 direct ld a,$55 indexed ld a,($55,x) indirect ld a,([$55],x) relative jrne loop bit operation bset byte,#5 mode syntax destination/ source pointer address (hex.) pointer size (hex.) length (bytes) inherent nop + 0 immediate ld a,#$55 + 1 short direct ld a,$10 00..ff + 1 long direct ld a,$1000 0000..ffff + 2 no offset direct indexed ld a,(x) 00..ff + 0 (with x register) + 1 (with y register) short direct indexed ld a,($10,x) 00..1fe + 1 long direct indexed ld a, ($1000,x) 0000..ffff + 2 short indirect ld a,[$10] 00..ff 00..ff byte + 2 long indirect ld a,[$10.w] 0000..ffff 00..ff word + 2 short indirect indexed ld a,([$10 ],x) 00..1fe 00..ff byte + 2 long indirect indexed ld a,([$10.w ],x) 0000..ffff 00..ff word + 2 relative direct jrne loop pc-128/pc+127 1) + 1 relative indirect jrne [$10] pc-128/pc+127 1) 00..ff byte + 2 bit direct bset $10,#7 00..ff + 1 bit indirect bset [$10],#7 00..ff 00..ff byte + 2 bit direct relative btjt $10,#7,skip 00..ff + 2 bit indirect relative btjt [$10] ,#7,skip 00..ff 00..ff byte + 3 1
st7lite0xy0, st7litesxy0 76/124 st7 addressing modes (cont?d) 12.1.1 inherent all inherent instructions consist of a single byte. the opcode fully specifies all the required informa- tion for the cpu to process the operation. 12.1.2 immediate immediate instructions have 2 bytes, the first byte contains the opcode, the second byte contains the operand value. 12.1.3 direct in direct instructions, the operands are referenced by their memory address. the direct addressing mode consists of two sub- modes: direct (short) the address is a byte, thus requires only 1 byte af- ter the opcode, but only allows 00 - ff addressing space. direct (long) the address is a word, thus allowing 64 kbyte ad- dressing space, but requires 2 bytes after the op- code. 12.1.4 indexed (no offset, short, long) in this mode, the operand is referenced by its memory address, which is defined by the unsigned addition of an index register (x or y) with an offset. the indirect addressing mode consists of three submodes: indexed (no offset) there is no offset (no extra byte after the opcode), and allows 00 - ff addressing space. indexed (short) the offset is a byte, thus requires only 1 byte after the opcode and allows 00 - 1fe addressing space. indexed (long) the offset is a word, thus allowing 64 kbyte ad- dressing space and requires 2 bytes after the op- code. 12.1.5 indirect (short, long) the required data byte to do the operation is found by its memory address, located in memory (point- er). the pointer address follows the opcode. the indi- rect addressing mode consists of two submodes: indirect (short) the pointer address is a byte, the pointer size is a byte, thus allowing 00 - ff addressing space, and requires 1 byte after the opcode. indirect (long) the pointer address is a byte, the pointer size is a word, thus allowing 64 kbyte addressing space, and requires 1 byte after the opcode. inherent instruction function nop no operation trap s/w interrupt wfi wait for interrupt (low power mode) halt halt oscillator (lowest power mode) ret subroutine return iret interrupt subroutine return sim set interrupt mask rim reset interrupt mask scf set carry flag rcf reset carry flag rsp reset stack pointer ld load clr clear push/pop push/pop to/from the stack inc/dec increment/decrement tnz test negative or zero cpl, neg 1 or 2 complement mul byte multiplication sll, srl, sra, rlc, rrc shift and rotate operations swap swap nibbles immediate instruction function ld load cp compare bcp bit compare and, or, xor logical operations adc, add, sub, sbc arithmetic operations 1
st7lite0xy0, st7litesxy0 77/124 st7 addressing modes (cont?d) 12.1.6 indirect indexed (short, long) this is a combination of indirect and short indexed addressing modes. the operand is referenced by its memory address, which is defined by the un- signed addition of an index register value (x or y) with a pointer value located in memory. the point- er address follows the opcode. the indirect indexed addressing mode consists of two submodes: indirect indexed (short) the pointer address is a byte, the pointer size is a byte, thus allowing 00 - 1fe addressing space, and requires 1 byte after the opcode. indirect indexed (long) the pointer address is a byte, the pointer size is a word, thus allowing 64 kbyte addressing space, and requires 1 byte after the opcode. table 19. instructions supporting direct, indexed, indirect and indirect indexed addressing modes 12.1.7 relative mode (direct, indirect) this addressing mode is used to modify the pc register value by adding an 8-bit signed offset to it. the relative addressing mode consists of two sub- modes: relative (direct) the offset follows the opcode. relative (indirect) the offset is defined in memory, of which the ad- dress follows the opcode. long and short instructions function ld load cp compare and, or, xor logical operations adc, add, sub, sbc arithmetic addition/subtrac- tion operations bcp bit compare short instructions only function clr clear inc, dec increment/decrement tnz test negative or zero cpl, neg 1 or 2 complement bset, bres bit operations btjt, btjf bit test and jump opera- tions sll, srl, sra, rlc, rrc shift and rotate operations swap swap nibbles call, jp call or jump subroutine available relative direct/ indirect instructions function jrxx conditional jump callr call relative 1
st7lite0xy0, st7litesxy0 78/124 12.2 instruction groups the st7 family devices use an instruction set consisting of 63 instructions. the instructions may be subdivided into 13 ma in groups as illustrated in the following table: using a prebyte the instructions are described with 1 to 4 bytes. in order to extend the number of available op- codes for an 8-bit cpu (256 opcodes), three differ- ent prebyte opcodes are defined. these prebytes modify the meaning of the instruction they pre- cede. the whole instruction becomes: pc-2 end of previous instruction pc-1 prebyte pc opcode pc+1 additional word (0 to 2) according to the number of bytes required to compute the effective address these prebytes enable instruction in y as well as indirect addressing modes to be implemented. they precede the opcode of the instruction in x or the instruction using direct addressing mode. the prebytes are: pdy 90 replace an x based instruction using immediate, direct, indexed, or inherent addressing mode by a y one. pix 92 replace an instruction using direct, di- rect bit or direct relative addressing mode to an instruction using the corre- sponding indirect addressing mode. it also changes an instruction using x indexed addressing mode to an instruc- tion using indirect x indexed addressing mode. piy 91 replace an instruction using x indirect indexed addressing mode by a y one. 12.2.1 illegal opcode reset in order to provide enhanced robustness to the de- vice against unexpected be havior, a system of ille- gal opcode detection is implemented. if a code to be executed does not correspond to any opcode or prebyte value, a reset is generated. this, com- bined with the watchdog, allows the detection and recovery from an unexpected fault or interference. note: a valid prebyte associated with a valid op- code forming an unauthorized combination does not generate a reset. load and transfer ld clr stack operation push pop rsp increment/decrement inc dec compare and tests cp tnz bcp logical operations and or xor cpl neg bit operation bset bres conditional bit test and branch btjt btjf arithmetic operations adc add sub sbc mul shift and rotates sll srl sra rlc rrc swap sla unconditional jump or call jra jrt jrf jp call callr nop ret conditional branch jrxx interruption management trap wfi halt iret condition code flag modification sim rim scf rcf 1
st7lite0xy0, st7litesxy0 79/124 instruction groups (cont?d) mnemo description function/example dst src h i n z c adc add with carry a = a + m + c a m h n z c add addition a = a + m a m h n z c and logical and a = a . m a m n z bcp bit compare a, memory tst (a . m) a m n z bres bit reset bres byte, #3 m bset bit set bset byte, #3 m btjf jump if bit is false (0) btjf byte, #3, jmp1 m c btjt jump if bit is true (1) btjt byte, #3, jmp1 m c call call subroutine callr call subroutine relative clr clear reg, m 0 1 cp arithmetic compare tst(reg - m) reg m n z c cpl one complement a = ffh-a reg, m n z 1 dec decrement dec y reg, m n z halt halt 0 iret interrupt routine return pop cc, a, x, pc h i n z c inc increment inc x reg, m n z jp absolute jump jp [tbl.w] jra jump relative always jrt jump relative jrf never jump jrf * jrih jump if ext. interrupt = 1 jril jump if ext. interrupt = 0 jrh jump if h = 1 h = 1 ? jrnh jump if h = 0 h = 0 ? jrm jump if i = 1 i = 1 ? jrnm jump if i = 0 i = 0 ? jrmi jump if n = 1 (minus) n = 1 ? jrpl jump if n = 0 (plus) n = 0 ? jreq jump if z = 1 (equal) z = 1 ? jrne jump if z = 0 (not equal) z = 0 ? jrc jump if c = 1 c = 1 ? jrnc jump if c = 0 c = 0 ? jrult jump if c = 1 unsigned < jruge jump if c = 0 jmp if unsigned >= jrugt jump if (c + z = 0) unsigned > 1
st7lite0xy0, st7litesxy0 80/124 instruction groups (cont?d) mnemo description function/example dst src h i n z c jrule jump if (c + z = 1) unsigned <= ld load dst <= src reg, m m, reg n z mul multiply x,a = x * a a, x, y x, y, a 0 0 neg negate (2's compl) neg $10 reg, m n z c nop no operation or or operation a = a + m a m n z pop pop from the stack pop reg reg m pop cc cc m h i n z c push push onto the stack push y m reg, cc rcf reset carry flag c = 0 0 ret subroutine return rim enable interrupts i = 0 0 rlc rotate left true c c <= dst <= c reg, m n z c rrc rotate right true c c => dst => c reg, m n z c rsp reset stack pointer s = max allowed sbc subtract with carry a = a - m - c a m n z c scf set carry flag c = 1 1 sim disable interrupts i = 1 1 sla shift left arithmetic c <= dst <= 0 reg, m n z c sll shift left logic c <= dst <= 0 reg, m n z c srl shift right logic 0 => dst => c reg, m 0 z c sra shift right arithmetic dst7 => dst => c reg, m n z c sub subtraction a = a - m a m n z c swap swap nibbles dst[7..4] <=> dst[3..0] reg, m n z tnz test for neg & zero tnz lbl1 n z trap s/w trap s/w interrupt 1 wfi wait for interrupt 0 xor exclusive or a = a xor m a m n z 1
st7lite0xy0, st7litesxy0 81/124 13 electrical characteristics 13.1 parameter conditions unless otherwise specified, all voltages are re- ferred to v ss . 13.1.1 minimum and maximum values unless otherwise specified the minimum and max- imum values are guaranteed in the worst condi- tions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at t a =25c and t a =t a max (given by the selected temperature range). data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. based on characterization, the min- imum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean3 ). 13.1.2 typical values unless otherwise specified, typical data are based on t a =25c, v dd =5v (for the 4.5v v dd 5.5v voltage range), v dd =3.3v (for the 3v v dd 3.6v voltage range) and v dd =2.7v (for the 2.4v v dd 3v voltage range). they are given only as design guidelines and are not tested. 13.1.3 typical curves unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 13.1.4 loading capacitor the loading conditions used for pin parameter measurement are shown in figure 46 . figure 46. pin loading conditions 13.1.5 pin input voltage the input voltage measurement on a pin of the de- vice is described in figure 47 . figure 47. pin input voltage c l st7 pin v in st7 pin 1
st7lite0xy0, st7litesxy0 82/124 13.2 absolute ma ximum ratings stresses above those listed as ?absolute maxi- mum ratings? may cause permanent damage to the device. this is a stress rating only and func- tional operation of the device under these condi- tions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. 13.2.1 voltage characteristics 13.2.2 current characteristics 13.2.3 thermal characteristics notes: 1. directly connecting the i/o pins to v dd or v ss could damage the device if an unexpect ed change of the i/o configura- tion occurs (for example, due to a co rrupted program counter). to guarantee safe operation, this connection has to be done through a pull-up or pull-dow n resistor (typical: 10k ? for i/os). unused i/o pins must be tied in the same way to v dd or v ss according to their reset configurat ion. for reset pin, please refer to figure 80 . 2. i inj(pin) must never be exceeded. this is implicitly insured if v in maximum is respected. if v in maximum cannot be respected, the injection current mu st be limited externally to the i inj(pin) value. a positive injection is induced by v in >v dd while a negative injection is induced by v in st7lite0xy0, st7litesxy0 83/124 13.3 operating conditions 13.3.1 general operating conditions: suffix 6 devices t a = -40 to +85c unless otherwise specified. figure 48. f clkin maximum operating frequency versus v dd supply voltage note: for further information on clock management and f clkin description, refer to figure 14 in section 7 on page 24 symbol parameter conditions min max unit v dd supply voltage f osc = 8 mhz. max., 2.4 5.5 v f osc = 16 mhz. max. 3.3 5.5 f clkin external clock frequency on clkin pin 3.3v v dd 5.5v up to 16 mhz 2.4v v dd < 3.3v up to 8 f clkin [mhz] supply voltage [v] 16 8 4 1 0 2.0 2.4 3.3 3.5 4.0 4.5 5.0 functionality not guaranteed in this area 5.5 functionality guaranteed in this area (unless otherwise stated in the tables of parametric data) 2.7 1
st7lite0xy0, st7litesxy0 84/124 13.3.2 operating condi tions with low voltage detector (lvd) t a = -40 to 85c, unless otherwise specified notes: 1. not tested in production. 2. not tested in production. the v dd rise time rate condition is needed to ensur e a correct device power-on and lvd reset. when the v dd slope is outside these values, the lvd ma y not ensure a proper reset of the mcu. 13.3.3 auxiliary voltage detector (avd) thresholds t a = -40 to 85c, unless otherwise specified symbol parameter conditions min typ max unit v it+ (lvd) reset release threshold (v dd rise) high threshold med. threshold low threshold 4.00 1) 3.40 1) 2.65 1) 4.25 3.60 2.90 4.50 3.80 3.15 v v it- (lvd) reset generation threshold (v dd fall) high threshold med. threshold low threshold 3.80 3.20 2.40 4.05 3.40 2.70 4.30 1) 3.65 1) 2.90 1) v hys lvd voltage threshold hysteresis v it+ (lvd) -v it- (lvd) 200 mv vt por v dd rise time rate 2) 20 20000 s/v t g(vdd) filtered glitch delay on v dd not detected by the lvd 150 ns i dd(lvd ) lvd/avd current consumption 220 a symbol parameter conditions min typ max unit v it+ (avd) 1=>0 avdf flag toggle threshold (v dd rise) high threshold med. threshold low threshold 4.40 3.90 3.20 4.70 4.10 3.40 5.00 4.30 3.60 v v it- (avd) 0=>1 avdf flag toggle threshold (v dd fall) high threshold med. threshold low threshold 4.30 3.70 2.90 4.60 3.90 3.20 4.90 4.10 3.40 v hys avd voltage threshold hysteresis v it+ (avd) -v it- (avd) 150 mv ? v it- voltage drop between avd flag set and lvd reset activation v dd fall 0.45 v 1
st7lite0xy0, st7litesxy0 85/124 13.3.4 internal rc oscillator and pll the st7 internal clock can be supplie d by an internal rc oscillator and pll (selectable by option byte). the rc oscillator and pll ch aracteristics are temper ature-dependent and are grou ped in two tables. 13.3.4.1 devices with ?6? order code suffix (tested for t a = -40 to +85c) @ v dd = 4.5 to 5.5v notes: 1. if the rc oscillator clock is select ed, to improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typi cally 100nf, between the v dd and v ss pins as close as possible to the st7 device. 2. see ?internal rc oscillator adjustment? on page 24 3. data based on characterization results, not tested in production 4. averaged over a 4ms period. after the locked bit is set, a period of t stab is required to reach acc pll accuracy 5. after the locked bit is set acc pll is max. 10% until t stab has elapsed. see figure 13 on page 25 . 6. guaranteed by design. symbol parameter conditions min typ max unit v dd(rc) internal rc oscillator operating voltage 2.4 5.5 v v dd(x4pll) x4 pll operating voltage 2.4 3.3 v dd(x8pll) x8 pll operating voltage 3.3 5.5 t startup pll startup time 60 pll input clock (f pll ) cycles symbol parameter conditions min typ max unit f rc 1) internal rc oscillator fre- quency rccr = ff (reset value), t a =25c, v dd =5v 760 khz rccr = rccr0 2 ) ,t a =25c, v dd =5v 1000 acc rc accuracy of internal rc oscillator with rccr=rccr0 2) t a =25c,v dd =4.5 to 5.5v -1 + 1% t a =-40 to +85c, v dd =5v -5 +2 % t a =0 to +85c, v dd =4.5 to 5.5v -2 3) +2 3) % i dd(rc) rc oscillator current con- sumption t a =25c,v dd =5v 970 3) a t su(rc) rc oscillator setup time t a =25c,v dd =5v 10 2) s f pll x8 pll input clock 1 3) mhz t lock pll lock time 5) 2ms t stab pll stabilization time 5) 4ms acc pll x8 pll accuracy f rc = 1mhz@t a =25c, v dd =4.5 to 5.5v 0.1 4) % f rc = 1mhz@t a =-40 to +85c, v dd =5v 0.1 4) % t w(jit) pll jitter period f rc = 1mhz 8 6) khz jit pll pll jitter ( ? f cpu /f cpu )1 6) % i dd(pll) pll current consumption t a =25c 600 3) a 1
st7lite0xy0, st7litesxy0 86/124 operating conditions (cont?d) 13.3.4.2 devices with ??6? order code suffix (tested for t a = -40 to +85c) @ v dd = 2.7 to 3.3v notes: 1. if the rc oscillator clock is select ed, to improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typi cally 100nf, between the v dd and v ss pins as close as possible to the st7 device. 2. see ?internal rc oscillator adjustment? on page 24. 3. data based on characterization results, not tested in production 4. averaged over a 4ms period. after the locked bit is set, a period of t stab is required to reach acc pll accuracy 5. after the locked bit is set acc pll is max. 10% until t stab has elapsed. see figure 13 on page 25 . 6. guaranteed by design. symbol parameter conditions min typ max unit f rc 1) internal rc oscillator fre- quency rccr = ff (reset value), t a =25c, v dd = 3.0v 560 khz rccr=rccr1 2) ,t a =25c, v dd = 3v 700 acc rc accuracy of internal rc oscillator when calibrated with rccr=rccr1 2)3) t a =25c,v dd =3v -2 +2 % t a =25c,v dd =2.7 to 3.3v -25 +25 % t a =-40 to +85c, v dd =3v -15 15 % i dd(rc) rc oscillator current con- sumption t a =25c,v dd =3v 700 3) a t su(rc) rc oscillator setup time t a =25c,v dd =3v 10 2) s f pll x4 pll input clock 0.7 3) mhz t lock pll lock time 5) 2ms t stab pll stabilization time 5) 4ms acc pll x4 pll accuracy f rc = 1mhz@t a =25c, v dd =2.7 to 3.3v 0.1 4) % f rc = 1mhz@t a =40 to +85c, v dd = 3v 0.1 4) % t w(jit) pll jitter period f rc = 1mhz 8 6) khz jit pll pll jitter ( ? f cpu /f cpu )1 6) % i dd(pll) pll current consumption t a =25c 190 3) a 1
st7lite0xy0, st7litesxy0 87/124 operating conditions (cont?d) figure 49. rc osc freq vs v dd @ t a =25c (calibrated with rccr1: 3v @ 25c) figure 50. rc osc freq vs v dd (calibrated with rccr0: 5v@ 25c) figure 51. typical rc oscillator accuracy vs temperature @ v dd =5v (calibrated with rccr0: 5v @ 25c figure 52. rc osc freq vs v dd and rccr value figure 53. pll ? f cpu /f cpu versus time 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 v dd ( v ) output freq (mhz ) 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 2.533.544.555.56 vdd (v) output freq. (mhz) -45 0 25 90 105 130 2 -1 -5 -45 025 85 -2 -4 -3 0 1 ( * ) ( * ) ( * ) ( * ) tested in production temperature (c) rc accuracy 125 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.4 2.7 3 3.3 3.75 4 4.5 5 5.5 6 vdd (v) output freq. (mhz) rccr=00h rccr=64h rccr=80h rccr=c0h rccr=ffh t w(jit) ? f cpu /f cpu t min max 0 t w(jit) 1
st7lite0xy0, st7litesxy0 88/124 operating conditions (cont?d) figure 54. pllx4 output vs clkin frequency note: f osc = f clkin /2*pll4 figure 55. pllx8 output vs clkin frequency note: f osc = f clkin /2*pll8 1.00 2.00 3.00 4.00 5.00 6.00 7.00 11.522.53 external input clock frequency (mhz) output frequency (mhz) 3.3 3 2.7 1.00 3.00 5.00 7.00 9.00 11.00 0.85 0.9 1 1.5 2 2.5 external input clock frequency (mhz) output frequency (mhz) 5.5 5 4.5 4 1
st7lite0xy0, st7litesxy0 89/124 13.4 supply current characteristics the following current consumption specified for the st7 functional operating modes over tempera- ture range does not take into account the clock source current consumption. to get the total de- vice consumption, the two current values must be added (except for halt mode for which the clock is stopped). 13.4.1 supply current t a = -40 to +85c unless otherwise specified notes: 1. cpu running with memory access, all i/o pi ns in input mode with a static value at v dd or v ss (no load), all peripherals in reset state; clock input (clkin) driv en by external square wave, lvd disabled. 2. all i/o pins in input mode with a static value at v dd or v ss (no load), all peripherals in re set state; clock input (clkin) driven by external square wave, lvd disabled. 3. slow mode selected with f cpu based on f osc divided by 32. all i/o pins in i nput mode with a static value at v dd or v ss (no load), all peripherals in reset state; clock input (clkin) driven by external square wave, lvd disabled. 4. slow-wait mode selected with f cpu based on f osc divided by 32. all i/o pins in input mode with a static value at v dd or v ss (no load), all peripher als in reset state; clock input (clkin) dr iven by external square wave, lvd disabled. 5. all i/o pins in output mode with a static value at v ss (no load), lvd disabled. data based on characterization results, tested in production at v dd max and f cpu max. figure 56. typical i dd in run vs. f cpu figure 57. typical i dd in slow vs. f cpu symbol parameter conditions typ max unit i dd supply current in run mode v dd =5.5v f cpu =8mhz 1) 4.50 7.00 ma supply current in wait mode f cpu =8mhz 2) 1.75 2.70 supply current in slow mode f cpu =250khz 3) 0.75 1.13 supply current in slow wait mode f cpu =250khz 4) 0.65 1 supply current in halt mode 5) -40c t a +85c 0.50 10 a -40c t a +105c tbd tbd t a = +85c 5 100 0.0 1.0 2.0 3.0 4.0 5.0 2.4 2.7 3.7 4.5 5 5.5 vdd (v) idd (ma) 8mhz 4mhz 1mhz 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 2.4 2.7 3.7 4.5 5 5.5 vdd (v) idd (ma) 250khz 125khz 62.5khz 1
st7lite0xy0, st7litesxy0 90/124 supply current characteristics (cont?d) figure 58. typical i dd in wait vs. f cpu figure 59. typical i dd in slow-wait vs. f cpu figure 60. typical i dd vs. temperature at v dd = 5v and f cpu = 8mhz 13.4.2 on-chip peripherals 1. data based on a differential i dd measurement between reset configuration (timer stopped) and a timer running in pwm mode at f cpu =8mhz. 2. data based on a differential i dd measurement between reset configurati on and a permanent spi master communica- tion (data sent equal to 55h). 3. data based on a differential i dd measurement between reset configuration and continuous a/d conversions with am- plifier off. 0.0 0.5 1.0 1.5 2.0 2.4 2.7 3.7 4.5 5 5.5 vdd (v) idd (ma) 8mhz 4mhz 1mhz 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 2.4 2.7 3.7 4.5 5 5.5 vdd (v) idd (ma) 250khz 125khz 62.5khz 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 -45 25 90 130 temperature (c) idd (ma) run wait slow slow wait symbol parameter conditions typ unit i dd(at) 12-bit auto-reload timer supply current 1) f cpu =4mhz v dd = 3.0v 150 a f cpu =8mhz v dd = 5.0v 250 i dd(spi) spi supply current 2) f cpu =4mhz v dd = 3.0v 50 f cpu =8mhz v dd = 5.0v 300 i dd(adc) adc supply current when converting 3) f adc =4mhz v dd = 3.0v 780 v dd = 5.0v 1100 1
st7lite0xy0, st7litesxy0 91/124 13.5 clock and timing characteristics subject to general operating conditions for v dd , f osc , and t a . 13.5.1 general timings 13.5.2 external clock source notes: 1. guaranteed by design. not tested in production. 2. data based on typical application software. 3. time measured between interrupt ev ent and interrupt vector fetch. ? t c(inst) is the number of t cpu cycles needed to fin- ish the current instruction execution. 4. data based on design simulation and/or technology characteristics, not tested in production. figure 61. typical application with an external clock source symbol parameter 1) conditions min typ 2) max unit t c(inst) instruction cycle time f cpu =8mhz 2312t cpu 250 375 1500 ns t v(it) interrupt reaction time 3) t v(it) = ? t c(inst) + 10 f cpu =8mhz 10 22 t cpu 1.25 2.75 s symbol parameter conditions min typ max unit v clkinh clkin input pin high level voltage see figure 61 0.7xv dd v dd v v clkinl clkin input pin low level voltage v ss 0.3xv dd t w(clkinh) t w(clkinl) clkin high or low time 4) 15 ns t r(clkin) t f(clkin) clkin rise or fall time 4) 15 i l clkin input leakage current v ss v in v dd 1 a clkin f osc external st72xxx clock source v clkinl v clkinh t r(clkin) t fclkin) t w(clkinh) t w(clkinl) i l 90% 10% 1
st7lite0xy0, st7litesxy0 92/124 13.6 memory characteristics t a = -40c to 105c, unless otherwise specified 13.6.1 ram and hardware registers 13.6.2 flash program memory 13.6.3 eeprom data memory notes: 1. minimum v dd supply voltage without losing data stored in ram (in halt mode or under reset) or in hardware reg- isters (only in halt mode). guaranteed by construction, not tested in production. 2. up to 32 bytes can be programmed at a time. 3. the data retention time increases when the t a decreases. 4. data based on reliability test re sults and monitored in production. 5. data based on characterization re sults, not tested in production. 6. guaranteed by design. not tested in production. 7. design target value pending fu ll product characterization. symbol parameter conditions min typ max unit v rm data retention mode 1) halt mode (or reset) 1.6 v symbol parameter conditions min typ max unit v dd operating voltage for flash write/erase 2.4 5.5 v t prog programming time for 1~32 bytes 2) t a =? 40 to +105c 5 10 ms programming time for 1.5 kbytes t a = +25c 0.24 0.48 s t ret data retention 4) t a = +55c 3) 20 years n rw write erase cycles t a = +25c 10k 7) cycles i dd supply current read / write / erase modes f cpu = 8mhz, v dd = 5.5v 2.6 6) ma no read/no write mode 100 a power down mode / halt 0 0.1 a symbol parameter conditions min typ max unit v dd operating voltage for eeprom write/erase 2.4 5.5 v t prog programming time for 1~32 bytes t a =? 40 to +105c 5 10 ms t ret data retention 4) t a =+55c 3) 20 years n rw write erase cycles t a = +25c 300k 7) cycles 1
st7lite0xy0, st7litesxy0 93/124 13.7 emc (electromagnetic compatibility) characteristics susceptibility tests are pe rformed on a sample ba- sis during product characterization. 13.7.1 functional ems (electro magnetic susceptibility) based on a simple running application on the product (toggling two -+leds through i/o ports), the product is stressed by two electro magnetic events until a failure occurs (indicated by the leds). esd : electro-static discharge (positive and negative) is applied on all pins of the device until a functional disturba nce occurs. this test conforms with the iec 1000-4-2 standard. ftb : a burst of fast transient voltage (positive and negative) is applied to v dd and v ss through a 100pf capacitor, until a functional disturbance occurs. this test confor ms with the iec 1000-4- 4 standard. a device reset allows normal operations to be re- sumed. the test results are given in the table be- low based on the ems levels and classes defined in application note an1709. 13.7.1.1 designing hardened software to avoid noise problems emc characterization and optimization are per- formed at component level with a typical applica- tion environment and simplified mcu software. it should be noted that good emc performance is highly dependent on the user application and the software in particular. therefore it is recommended that the user applies emc software optimization and prequalification tests in relation with the emc level requested for his application. software recommendations: the software flowchart must include the manage- ment of runaway conditions such as: ? corrupted program counter ? unexpected reset ? critical data corruption (control registers...) prequalification trials: most of the common failures (unexpected reset and program counter corruption) can be repro- duced by manually forcing a low state on the re- set pin or the oscillator pins for 1 second. to complete these trials, esd stress can be ap- plied directly on the device, over the range of specification values. when unexpected behaviour is detected, the software can be hardened to pre- vent unrecoverable errors occurring (see applica- tion note an1015). 13.7.2 emi (electromagnetic interference) based on a simple application running on the product (toggling two leds through the i/o ports), the product is monitored in terms of emission. this emission test is in line with the norm sae j 1752/3 which specifies the board and the loading of each pin. note: 1. data based on characterization re sults, not tested in production. symbol parameter conditions level/ class v fesd voltage limits to be applied on any i/o pin to induce a functional disturbance v dd = 5v, t a = +25c, f osc = 8mhz conforms to iec 1000-4-2 2b v fftb fast transient voltage bur st limits to be applied through 100pf on v dd and v dd pins to induce a func- tional disturbance v dd = 5v, t a = +25c, f osc = 8mhz conforms to iec 1000-4-4 3b table 20: emi emissions symbol parameter conditions monitored frequency band max vs. [f osc /f cpu ] unit 1/4mhz 1/8mhz s emi peak level v dd = 5v, t a = +25c, so16 package, conforming to sae j 1752/3 0.1mhz to 30mhz 8 14 db v 30mhz to 130mhz 27 32 130mhz to 1ghz 26 28 sae emi level 3.5 4 - 1
st7lite0xy0, st7litesxy0 94/124 emc characteristics (cont?d) 13.7.3 absolute maximum ratings (electrical sensitivity) based on two different tests (esd and lu) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. 13.7.3.1 electro-static discharge (esd) electro-static discharges (a positive then a nega- tive pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. the sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). this test conforms to the jesd22- a114a standard. esd absolute maximum ratings notes: 1. data based on characterization results, not tested in production. 13.7.3.2 static latch-up lu : two complementary static tests are required on 10 parts to assess the latch-up performance. a supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable i/ o pin) are performed on each sample. these test are compliant with the eia/jesd 78 ic latch-up standard. electrical sensitivities note: 1. class description: a class is an stmicroel ectronics internal specific ation. all its limits are hi gher than the jedec spec- ifications, that means when a device belongs to class a it exceeds the jedec standar d. b class strictly covers all the jedec criteria (int ernational standard). symbol ratings conditions maximum value 1) unit v esd(hbm) electro-static discharge voltage (human body model) t a = +25c conforming to jesd22-a114 4000 v symbol parameter conditions class 1) lu static latch-up class t a = +25c conforming to jesd78a ii level a 1
st7lite0xy0, st7litesxy0 95/124 13.8 i/o port pin characteristics 13.8.1 general characteristics subject to general operating conditions for v dd , f osc , and t a unless otherwise specified. notes: 1. data based on characterization re sults, not tested in production. 2. configuration not recommended, all unused pins must be kept at a fixed voltage: using t he output mode of the i/o for example or an external pull- up or pull-down resistor (see figure 66 ). static peak current val ue taken at a fixed v in value, based on design simulation and technology characteristics, not tested in production. this value depends on v dd and tem- perature values. 3. the r pu pull-up equivalent resistor is based on a resistive transistor (corresponding i pu current characteristics de- scribed in figure 63 ). 4. to generate an external interrupt, a mi nimum pulse width has to be applied on an i/o port pin configured as an external interrupt source. figure 62. two typical applications wi th unused i/o pin configured as input figure 63. typical i pu vs. v dd with v in =v ss l symbol parameter conditions min typ max unit v il input low level voltage v ss - 0.3 0.3xv dd v v ih input high level voltage 0.7xv dd v dd + 0.3 v hys schmitt trigger voltage hysteresis 1) 400 mv i l input leakage current v ss v in v dd 1 a i s static current consumption induced by each floating input pin 2) floating input mode 400 r pu weak pull-up equivalent resistor 3) v in = v ss v dd =5v 50 120 250 k ? v dd =3v 160 c io i/o pin capacitance 5 pf t f(io)out output high to low level fall time 1) c l =50pf between 10% and 90% 25 ns t r(io)out output low to high level rise time 1) 25 t w(it)in external interrupt pulse time 4) 1t cpu 10k ? unused i/o port st7xxx 10k ? unused i/o port st7xxx v dd caution : during normal operation the iccclk pin must be pulled- up, internally or externally (external pull-up of 10k mandatory in this is to avoid entering icc mode unexpectedly during a reset. noisy environment). note : i/o can be left unconnected if it is configured as output (0 or 1) by the software. this has the advantage of greater emc robustness and lower cost. to be characterized 0 10 20 30 40 50 60 70 80 90 22.533.5 44.555.56 vdd(v) ip u (ua ) ta=140c ta=95c ta=25c ta=-45c 1
st7lite0xy0, st7litesxy0 96/124 i/o port pin characteristics (cont?d) 13.8.2 output driving current subject to general operating conditions for v dd , f cpu , and t a unless otherwise specified. notes: 1. the i io current sunk must always respect t he absolute maximum rating specified in section 13.2.2 and the sum of i io (i/o ports and control pi ns) must not exceed i vss . 2. the i io current sourced must always respect t he absolute maximum rating specified in section 13.2.2 and the sum of i io (i/o ports and control pins) must not exceed i vdd . 3. not tested in production, based on characterization results. symbol parameter conditions min max unit v ol 1) output low level voltage for a standard i/o pin when 8 pins are sunk at same time (see figure 65 ) v dd =5v i io =+5ma t a 85c t a 85c 1.0 1.2 v i io =+2ma t a 85c t a 85c 0.4 0.5 output low level voltage for a high sink i/o pin when 4 pins are sunk at same time (see figure 66 ) i io =+20ma, t a 85c t a 85c 1.3 1.5 i io =+8ma t a 85c t a 85c 0.75 0.85 v oh 2) output high level voltage for an i/o pin when 4 pins are sourced at same time (see figure 72 ) i io =-5ma, t a 85c t a 85c v dd -1.5 v dd -1.6 i io =-2ma t a 85c t a 85c v dd -0.8 v dd -1.0 v ol 1)3) output low level voltage for a standard i/o pin when 8 pins are sunk at same time (see figure 64 ) v dd =3.3v i io =+2ma t a 85c t a 85c 0.5 0.6 output low level voltage for a high sink i/o pin when 4 pins are sunk at same time i io =+8ma t a 85c t a 85c 0.5 0.6 v oh 2)3) output high level voltage for an i/o pin when 4 pins are sourced at same time i io =-2ma t a 85c t a 85c v dd -0.8 v dd -1.0 v ol 1)3) output low level voltage for a standard i/o pin when 8 pins are sunk at same time v dd =2.7v i io =+2ma t a 85c t a 85c 0.6 0.7 output low level voltage for a high sink i/o pin when 4 pins are sunk at same time i io =+8ma t a 85c t a 85c 0.6 0.7 v oh 2)3) output high level voltage for an i/o pin when 4 pins are sourced at same time (see figure 69 ) i io =-2ma t a 85c t a 85c v dd -0.9 v dd -1.0 1
st7lite0xy0, st7litesxy0 97/124 i/o port pin characteristics (cont?d) figure 64. typical v ol at v dd =3.3v (standard) figure 65. typical v ol at v dd =5v (standard) figure 66. typical v ol at v dd =5v (high-sink) figure 67. typical v ol at v dd =3v (high-sink) figure 68. typical v dd -v oh at v dd =2.4v 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.01 1 2 3 lio (ma) vol at vdd=3.3v -45c 0c 25c 90c 130c 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.0112345 lio (ma) vol at vdd=5v -45c 0c 25c 90c 130c 0.00 0.50 1.00 1.50 2.00 2.50 6 7 8 9 10 15 20 25 30 35 40 lio (ma) vol (v) at vdd=5v (hs) -45 0c 25c 90c 130c 0.00 0.20 0.40 0.60 0.80 1.00 1.20 67891015 lio (ma) vol (v) at vdd=3v (hs) -45 0c 25c 90c 130c 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 -0.01 -1 -2 lio (ma) vdd-voh at vdd=2.4v -45c 0c 25c 90c 130c 1
st7lite0xy0, st7litesxy0 98/124 figure 69. typical v dd -v oh at v dd =2.7v figure 70. typical v dd -v oh at v dd =3v figure 71. typical v dd -v oh at v dd =4v figure 72. typical v dd -v oh at v dd =5v figure 73. typical v ol vs. v dd (standard i/os) 0.00 0.20 0.40 0.60 0.80 1.00 1.20 -0.01 -1 -2 lio(ma) vdd-voh at vdd=2.7v -45c 0c 25c 90c 130c 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 -0.01 -1 -2 -3 lio (ma) vdd-voh at vdd=3v -45c 0c 25c 90c 130c 0.00 0.50 1.00 1.50 2.00 2.50 -0.01-1-2-3-4-5 lio (ma) vdd-voh at vdd=4v -45c 0c 25c 90c 130c to be characterized 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 -0.01-1-2-3-4-5 lio (ma) vdd-voh at vdd=5v -45c 0c 25c 90c 130c 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 2.4 2.7 3.3 5 vdd (v) vol (v) at lio=2ma -45 0c 25c 90c 130c 0.00 0.01 0.02 0.03 0.04 0.05 0.06 2.4 2.7 3.3 5 vdd (v) vol (v) at lio=0.01ma -45 0c 25c 90c 130c 1
st7lite0xy0, st7litesxy0 99/124 figure 74. typical v ol vs. v dd (high-sink i/os) figure 75. typical v dd -v oh vs. v dd 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 2.4 3 5 vdd (v) vol vs vdd (hs) at lio=8ma -45 0c 25c 90c 130c 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 2.4 3 5 vdd (v) vol vs vdd (hs) at lio=20ma -45 0c 25c 90c 130c 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 2.42.7345 vdd (v) vdd-voh (v) at lio=-2ma -45c 0c 25c 90c 130c 0.80 0.90 1.00 1.10 1.20 1.30 1.40 1.50 1.60 1.70 1.80 45 vdd vdd-voh at lio=-5ma -45c 0c 25c 90c 130c 1
st7lite0xy0, st7litesxy0 100/124 13.9 control pin characteristics 13.9.1 asynchronous reset pin t a = -40c to 105c, unless otherwise specified notes: 1. data based on characterization results, not tested in production. 2. the i io current sunk must always respect t he absolute maximum rating specified in section 13.2.2 on page 82 and the sum of i io (i/o ports and control pins) must not exceed i vss . 3. the r on pull-up equivalent resistor is based on a resistiv e transistor. specified for voltages on reset pin between v ilmax and v dd 4. to guarantee the reset of the device, a mini mum pulse has to be applied to the reset pin. all short pulses applied on reset pin with a duration below t h(rstl)in can be ignored. symbol parameter conditions min typ max unit v il input low level voltage v ss - 0.3 0.3xv dd v v ih input high level voltage 0.7xv dd v dd + 0.3 v hys schmitt trigger voltage hysteresis 1) 2v v ol output low level voltage 2) v dd =5v i io =+5ma t a 85c t a 105c 0.5 1.0 1.2 v i io =+2ma t a 85c t a 105c 0.2 0.4 0.5 r on pull-up equivalent resistor 3) 1) v dd =5v 20 40 80 k ? t w(rstl)out generated reset pulse duration internal reset sources 30 s t h(rstl)in external reset pulse hold time 4) 20 s t g(rstl)in filtered glitch duration 200 ns 1
st7lite0xy0, st7litesxy0 101/124 control pin characteristics (cont?d) figure 76. reset pin protection when lvd is enabled. 1)2)3)4) figure 77. reset pin protection when lvd is disabled. 1) note 1: ? the reset network protects the device against parasitic resets. ? the output of the external reset circuit must have an open- drain output to drive the st7 reset pad. otherwise the device can be damaged when the st7 generates an internal reset (lvd or watchdog). ? whatever the reset source is (int ernal or external), the user must ensure that the level on the reset pin can go below the v il max. level specified in section 13.9.1 on page 100 . otherwise the reset will not be taken into account internally. ? because the reset circuit is designed to allow the internal reset to be output in the reset pin, the user must en- sure that the current sunk on the reset pin is less than the absolute maximum value specified for i inj(reset) in section 13.2.2 on page 82 . note 2: when the lvd is enabled, it is recommended not to c onnect a pull-up resistor or capacitor. a 10nf pull-down capacitor is required to fi lter noise on the reset line. note 3: in case a capacitive power supply is used, it is recommended to connect a 1m ? pull-down resistor to the reset pin to discharge any residual voltage induc ed by the capacitive effect of the power supply (this will add 5a to the power consumption of the mcu). note 4: tips when using the lvd: ? 1. check that all recommendations related to i ccclk and reset circuit have been applied (see caution in table 1 on page 7 and notes above) ? 2. check that the power supply is properly decoupled (100nf + 10f close to the mcu). refer to an1709 and an2017. if this cannot be done, it is recommended to put a 100nf + 1m ? pull-down on the reset pin. ? 3. the capacitors connected on the reset pin and also the power supply are key to avoi d any start-up marginality. in most cases, steps 1 and 2 above are sufficient for a robust solution. otherwise: replace 10nf pull-down on the reset pin with a 5f to 20f capacitor.? note 5: see ?illegal opcode reset? on page 78. for more details on illegal opcode reset conditions 0.01 f st72xxx pulse generator filter r on v dd internal reset reset external required 1m ? optional (note 3) watchdog lvd reset illegal opcode 5) 0.01 f external reset circuit user required st72xxx pulse generator filter r on v dd internal reset watchdog illegal opcode 5) 1
st7lite0xy0, st7litesxy0 102/124 13.10 communication interface characteristics 13.10.1 spi - serial peripheral interface subject to general operating conditions for v dd , f osc , and t a unless otherwise specified. refer to i/o port characteristics for more details on the input/output alternate function characteristics (ss , sck, mosi, miso). figure 78. spi slave timing diagram with cpha=0 3) notes: 1. data based on design simulation and/or charac terisation results, not tested in production. 2. when no communication is on-going the data output line of the spi (mosi in mast er mode, miso in slave mode) has its alternate function capability rel eased. in this case, the pin status depends on the i/o port configuration. 3. measurement points are done at cmos levels: 0.3xv dd and 0.7xv dd . 4. depends on f cpu . for example, if f cpu =8mhz, then t cpu = 1/f cpu =125ns and t su(ss ) =175ns symbol parameter conditions min max unit f sck = 1/t c(sck) spi clock frequency master f cpu =8mhz f cpu /128 = 0.0625 f cpu /4 = 2 mhz slave f cpu =8mhz 0 f cpu /2 = 4 t r(sck) t f(sck) spi clock rise and fall time see i/o port pin description t su(ss ) 1) ss setup time 4) slave t cpu + 50 ns t h(ss ) 1) ss hold time slave 120 t w(sckh) 1) t w(sckl) 1) sck high and low time master slave 100 90 t su(mi) 1) t su(si) 1) data input setup time master slave 100 100 t h(mi) 1) t h(si) 1) data input hold time master slave 100 100 t a(so) 1) data output access time slave 0 120 t dis(so) 1) data output disable time slave 240 t v(so) 1) data output valid time slave (after enable edge) 120 t h(so) 1) data output hold time 0 t v(mo) 1) data output valid time master (after enable edge) 120 t h(mo) 1) data output hold time 0 ss input sck input cpha=0 mosi input miso output cpha=0 t c(sck) t w(sckh) t w(sckl) t r(sck) t f(sck) t v(so) t a(so) t su(si) t h(si) msb out msb in bit6 out lsb in lsb out seenote2 cpol=0 cpol=1 t su(ss ) t h(ss ) t dis(so) t h(so) see note 2 bit1 in 1
st7lite0xy0, st7litesxy0 103/124 communication interface characteristics (cont?d) figure 79. spi slave timing diagram with cpha=1 1) figure 80. spi master timing diagram 1) notes: 1. measurement points are done at cmos levels: 0.3xv dd and 0.7xv dd . 2. when no communication is on-going the data output line of the spi (mosi in mast er mode, miso in slave mode) has its alternate function capability rel eased. in this case, the pin status depends of the i/o port configuration. ss input sck input cpha=1 mosi input miso output cpha=1 t w(sckh) t w(sckl) t r(sck) t f(sck) t a(so) t su(si) t h(si) msb out bit6 out lsb out see cpol=0 cpol=1 t su(ss ) t h(ss ) t dis(so) t h(so) see note 2 note 2 t c(sck) hz t v(so) msb in lsb in bit1 in ss input sck input cpha = 0 mosi output miso input cpha = 0 cpha = 1 cpha = 1 t c(sck) t w(sckh) t w(sckl) t h(mi) t su(mi) msb in msb out bit6 in bit6 out lsb out lsb in seenote2 seenote2 cpol = 0 cpol = 1 cpol = 0 cpol = 1 t r(sck) t f(sck) t h(mo) t v(mo)
st7lite0xy0, st7litesxy0 104/124 13.11 8-bit adc characteristics t a = -40c to 85c, unless otherwise specified notes: 1. unless otherwise specified, typical data are based on t a =25c and v dd -v ss =5v. they are given only as design guide- lines and are not tested. 2. data based on characterization re sults, not tested in production. 3. any added external serial resistor will downgrade the adc accuracy (espec ially for resistance greater than 10k ? ). data based on characterization resu lts, not tested in production. 4. the stabilization time of the ad converter is masked by the first t load . the first conversion after the enable is then always valid. figure 81. typical application with adc symbol parameter conditions min typ max unit f adc adc clock frequency 4 mhz v ain conversion voltage range v ss v dd v r ain external input resistor 10 1) k ? c adc internal sample and hold capacitor v dd =5v 3 pf t stab stabilization time after adc enable f cpu =8mhz, f adc =4mhz 0 2) s t conv conversion time (t sample +t hold )3 t sample sample capacitor loading time 4 1/f adc t hold hold conversion time 8 ainx st7xx v dd i l 1 a v t 0.6v v t 0.6v c adc 3pf v ain r ain 8-bit a/d conversion 2k ?( max ) c ain
st7lite0xy0, st7litesxy0 105/124 adc characteristics (cont?d) figure 82. r ain max. vs f adc with c ain =0pf 1) figure 83. recommended c ain /r ain values 2) notes: 1. c parasitic represents the capacitance of the pcb (dependent on soldering and pcb layout quality) plus the pad ca- pacitance (3pf). a high c parasitic value will downgrade conversion accuracy. to remedy this, f adc should be reduced. 2. this graph shows that depending on the input signal variation (f ain ), c ain can be increased for stabilization and to allow the use of a larger serial resistor (r ain) . it is valid for all f adc frequencies 4mhz. 13.11.1 general pcb design guidelines to obtain best results, some general design and layout rules should be followed when designing the application pcb to sh ield the noise-sensitive, analog physical interface from noise-generating cmos logic signals. properly place components and route the signal traces on the pcb to shield the analog inputs. an- alog signals paths should run over the analog ground plane and be as short as possible. isolate analog signals from digital signals that may switch while the analog inputs are being sampled by the a/d converter. do not toggle digital outputs on the same i/o port as the a/d input being converted. 0 5 10 15 20 25 30 35 40 45 0103070 c parasitic (pf) max. r ain (kohm) 4 mhz 2 mhz 1 mhz 0.1 1 10 100 1000 0.01 0.1 1 10 f ain (khz) max. r ain (kohm) cain 10 nf cain 22 nf cain 47 nf
st7lite0xy0, st7litesxy0 106/124 adc characteristics (cont?d) adc accuracy with v dd =5.0v t a = -40c to 85c, unle ss otherwise specified notes: 1. data based on characterization results over the whole temperature range, monitored in production. 2. injecting negative current on any of the analog input pins significantly reduces the accuracy of any conversion being performed on any analog input. analog pins can be protected against negative injection by adding a schottky di ode (pin to ground). injecting negative current on digital input pins degrades adc accuracy especi ally if performed on a pin cl ose to the analog input pins. any positive injection current wi thin the limits specified for i inj(pin) and i inj(pin) in section 13.8 does not affect the adc accuracy. ? symbol parameter conditions typ max unit e t total unadjusted error 2) f cpu =4mhz, f adc =2mhz ,v dd =5.0v 1 lsb e o offset error 2) -0.5 / +1 e g gain error 2) 1 e d differential li nearity error 2) 1 1) e l integral linearity error 2) 1 1) e t total unadjusted error 2) f cpu =8mhz, f adc =4mhz ,v dd =5.0v 2 lsb e o offset error 2) -0.5 / 3.5 e g gain error 2) -2 / 0 e d differential li nearity error 2) 1 1) e l integral linearity error 2) 1 1)
st7lite0xy0, st7litesxy0 107/124 adc characteristics (cont?d) figure 84. adc accuracy characteristics with amplifier disabled figure 85. adc accuracy characteristics with amplifier enabled note: when the ampsel bit in the adcdrl register is set, it is mandatory that f adc be less than or equal to 2 mhz. (if f cpu =8mhz. then speed=0, slow=1). e o e g 1lsb ideal 1lsb ideal v dda v ssa ? 256 ---------------------------------------- - = v in (lsb ideal ) (1) example of an actual transfer curve (2) the ideal transfer curve (3) end point correlation line e t =total unadjusted error: maximum deviation between the actual and the ideal transfer curves. e o =offset error: deviation between the first actual transition and the first ideal one. e g =gain error: deviation between the last ideal transition and the last actual one. e d =differential linearity error: maximum deviation between actual steps and the ideal one. e l =integral linearity error: maximum deviation between any actual transition and the end point correlation line. digital result adcdr 255 254 5 4 3 2 1 0 7 6 1234567 253 254 255 256 (1) (2) e t e d e l (3) v dda v ssa 253 e o e g 1lsb ideal v in (lsb ideal ) (1) example of an actual transfer curve (2) the ideal transfer curve (3) end point correlation line e t =total unadjusted error: maximum deviation between the actual and the ideal transfer curves. e o =offset error: deviation between the first actual transition and the first ideal one. e g =gain error: deviation between the last ideal transition and the last actual one. e d =differential linearity error: maximum deviation between actual steps and the ideal one. e l =integral linearity error: maximum deviation between any actual transition and the end point correlation line. n =amplifier offset digital result adcdr n+5 n+4 n+3 n+2 n+1 0 n+7 n+6 1234567 100 101 102 103 (1) (2) e t e d e l (3) 250 mv v ss
st7lite0xy0, st7litesxy0 108/124 adc characteristics (cont?d) notes: 1. data based on characterization results over t he whole temperature range, not tested in production. 2. for precise conversion results it is recommended to calibrate the ampl ifier at the following two points: ? offset at v inmin = 0v ? gain at full scale (for example v in =250mv) 3. monotonicity guaranteed if v in increases or decreases in steps of min. 5mv. symbol parameter conditions min typ max unit v dd(amp) amplifier operating voltage 4.5 5.5 v v in amplifier input voltage v dd =5v 0 250 mv v offset amplifier offset voltage 200 mv v step step size for monotonicity 3) 5mv linearity output voltage response linear gain factor amplified analog input gain 2) 7 1) 89 1) vmax output linearity max voltage v inmax = 250mv, v dd =5v 2.2 2.4 v vmin output linearity min voltage 200 mv vin vout (adc input) vmax vmin 0v 250mv 0v noise (opamp input)
st7lite0xy0, st7litesxy0 109/124 14 package characteristics in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level in- terconnect. the category of second level inter- connect is marked on the package and on the in- ner box label, in comp liance with jedec standard jesd97. the maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ecopack is an st tra demark. ecopack speci- fications are available at: www.st.com. 14.1 package mechanical data figure 86. 20-lead very thin fine pitch quad flat no-lead package dim. mm inches 1) note 1. values in inches are converted from mm and rounded to 4 decimal digits. min typ max min typ max a 0.80 0.85 0.90 0.0315 0.0335 0.0354 a1 0.00 0.02 0.05 0.0008 0.0020 a3 0.02 0.0008 b 0.25 0.30 0.35 0.0098 0.0118 0.0138 d 5.00 0.1969 d2 3.10 3.25 3.35 0.1220 0.1280 0.1319 e 6.00 0.2362 e2 4.10 4.25 4.35 0.1614 0.1673 0.1713 e 0.80 0.0315 l 0.45 0.50 0.55 0.0177 0.0197 0.0217 ddd 0.08 0.0031 number of pins n 20
st7lite0xy0, st7litesxy0 110/124 figure 87. 16-pin plastic dual in-line package, 300-mil width figure 88. 16-pin plastic small outline package, 150-mil width dim mm inches 1) note 1. values in inches are converted from mm and rounded to 4 decimal digits. min typ max min typ max a 5.33 0.2098 a1 0.38 0.0150 a2 2.92 3.30 4.95 0.1150 0.1299 0.1949 b 0.36 0.46 0.56 0.0142 0.0181 0.0220 b2 1.14 1.52 1.78 0.0449 0.0598 0.0701 b3 0.76 0.99 1.14 0.0299 0.0390 0.0449 c 0.20 0.25 0.36 0.0079 0.0098 0.0142 d 18.67 19.18 19.69 0.7350 0.7551 0.7752 d1 0.13 0.0051 e 2.54 0.1000 e 7.62 7.87 8.26 0.3000 0.3098 0.3252 e1 6.10 6.35 7.11 0.2402 0.2500 0.2799 l 2.92 3.30 3.81 0.1150 0.1299 0.1500 eb 10.92 0.4299 number of pins n 16 c e e1 eb l a a2 a1 e b b2 b3 d1 d dim. mm inches 1) note 1. values in inches are converted from mm and rounded to 4 decimal digits. min typ max min typ max a 1.35 1.75 0.0531 0.0689 a1 0.10 0.25 0.0039 0.0098 b 0.33 0.51 0.0130 0.0201 c 0.19 0.25 0.0075 0.0098 d 9.80 10.0 0 0.3858 0.3937 e 3.80 4.00 0.1496 0.1575 e 1.27 0.0500 h 5.80 6.20 0.2283 0.2441 0 8 0 8 l 0.40 1.27 0.0157 0.0500 number of pins n 16 e h a1 c 45 a a1 b d e 16 9 1 8 l
st7lite0xy0, st7litesxy0 111/124 14.2 thermal characteristics notes: 1. the maximum chip-junction temperature is based on technology characteristics. 2. the maximum power dissipation is obtained from the formula p d = (t j -t a ) / r thja . the power dissipation of an application can be defined by the user with the formula: p d =p int +p port where p int is the chip internal power (i dd xv dd ) and p port is the port power dissipation depending on the ports used in the application. symbol ratings value unit r thja package thermal resistance so16 (junction to ambient) dip16 95 tbd c/w t jmax maximum junction temperature 1) 150 c p dmax power dissipation 2) 500 mw
st7lite0xy0, st7litesxy0 112/124 15 device configuration and ordering information each device is available for production in user pro- grammable versions (flash) as well as in factory coded versions (fastrom). st7plite0x and st7plites2/s5 devices are factory advanced service technique rom (fas- trom) versions: they are factory-programmed xflash devices. st7flite0x and st7flites2/s5 xflash devices are shipped to customers with a default program memory content (ffh). the osc option bit is pro- grammed to 0 by default. the fastrom factory coded parts contain the code supplied by the customer. this implies that flash devices have to be configured by the cus- tomer using the option bytes while the fastrom devices are factory-configured. 15.1 option bytes the two option bytes allow the hardware configu- ration of the microcontroller to be selected. the option bytes can be accessed only in pro- gramming mode (for example using a standard st7 programming tool). option byte 0 bits 7:4 = reserved, must always be 1. bits 3:2 = sec[1:0] sector 0 size definition these option bits indicate the size of sector 0 ac- cording to the following table. note 1: configuration available for st7lite0x de- vices only. bit 1 = fmp_r read-out protection readout protection, when selected provides a pro- tection against program memory content extrac- tion and against write access to flash memory. erasing the option bytes when the fmp_r option is selected will cause the whole memory to be erased first, and the device can be reprogrammed. refer to section 4.5 and the st7 flash program- ming reference manual for more details. 0: read-out protection off 1: read-out protection on bit 0 = fmp_w flash write protection this option indicates if the flash program mem- ory is write protected. warning: when this option is selected, the pro- gram memory (and the option bit itself) can never be erased or programmed again. 0: write protection off 1: write protection on sector 0 size sec1 sec0 0.5k 00 1k 01 1.5k 1) 1x
st7lite0xy0, st7litesxy0 113/124 option bytes (cont?d) option byte 1 bit 7 = pllx4x8 pll factor selection. 0: pllx4 1: pllx8 bit 6 = plloff pll disabled 0: pll enabled 1: pll disabled (by-passed) bit 5 = reserved, must always be 1. bit 4 = osc rc oscillator selection 0: rc oscillator on 1: rc oscillator off note: if the rc oscillator is selected, then to im- prove clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nf, between the v dd and v ss pins as close as possible to the st7 device. table 21. list of valid option combinations note: see clock management block diagram in figure 14 bits 3:2 = lvd[1:0] low voltage detection selec- tion these option bits enable the lvd block with a se- lected threshold as shown in table 22 . table 22. lvd threshold configuration bit 1 = wdg sw hardware or software watchdog this option bit selects the watchdog type. 0: hardware (watch dog always enabled) 1: software (watchdog to be enabled by software) bit 0 = wdg halt watchdog reset on halt this option bit determines if a reset is generated when entering halt mode while the watchdog is active. 0: no reset generation when entering halt mode 1: reset generation when entering halt mode operating conditions option bits v dd range clock source pll typ f cpu osc plloff pllx4x8 2.4v - 3.3v internal rc 1% off 0.7mhz @3v 0 1 1 x4 2.8mhz @3v 0 0 0 x8 - - - - external clock off 0-4mhz 1 1 1 x4 4mhz 1 0 0 x8 - - - - 3.3v - 5.5v internal rc 1% off 1mhz @5v 0 1 1 x4 - - - - x8 8mhz @5v 0 0 1 external clock off 0-8mhz 1 1 1 x4 - - - - x8 8 mhz 1 0 1 configuration lvd1 lvd0 lvd off 11 highest voltage threshold ( 4.1v) 10 medium voltage threshold ( 3.5v) 01 lowest voltage threshold ( 2.8v) 00 option byte 0 70 option byte 1 70 reserved sec1 sec0 fmp r fmp w pll x4x8 pll off osc lvd1 lvd0 wdg sw wdg halt default value 1111110011101111
st7lite0xy0, st7litesxy0 114/124 15.2 device ordering informat ion and transfer of customer code customer code is made up of the fastrom con- tents and the list of the selected options (if any). the fastrom contents are to be sent on dis- kette, or by electronic means, with the s19 hexa- decimal file generated by the development tool. all unused bytes must be set to ffh. the selected op- tions are communicated to stmicroelectronics us- ing the correctly completed option list append- ed. refer to application note an1635 for information on the counter listing returned by st after code has been transferred. the stmicroelectronics sales organization will be pleased to provide detailed information on con- tractual points.
st7lite0xy0, st7litesxy0 115/124 figure 89. ordering information scheme st7 f lites5 y 0 m 6 tr family st7 microcontroller family memory type f: flash p: fastrom memory size 0 = 1k (litesx versions) or 1.5k (lite0x versions) package b = dip m = so u = qfn shipping option tr = tape & reel packing blank = tube (dip16 or so16) or tray (qfn20) example: no. of pins y = 16 sub-family lites2, lites5, lite02, lite05 or lite09 temperature range 6 = -40 c to 85 c for a list of available options (e.g. data eeprom, package) and orderable part numbers or for further information on any aspect of this device, pl ease contact the st sales office nearest to you.
st7lite0xy0, st7litesxy0 116/124 st7lite0xy0 and st7litesxy0 fastrom microcontroller option list (last update: november 2007) customer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . phone no . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . reference/fastrom code*: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . *fastrom code name is assigned by stmicroelectronics. fastrom code must be sent in .s19 format . .hex extension cannot be processed. warning: addresses 1000h, 1001h, ffdeh and ffdfh are reserved areas for st to program rccr0 and rccr1 (see section 7.1 on page 24 ). conditioning (check only one option): special marking: [ ] no [ ] yes authorized characters are letters, di gits, '.', '-', '/ ' and spaces only. maximum character count: pdip16 (15 char. max) : _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ so16 (11 char. max) : _ _ _ _ _ _ _ _ _ _ _ sector 0 size: [ ] 0.5k [ ] 1k [ ] 1.5k readout protection: [ ] disabled [ ] enabled flash write protection: [ ] disabled [ ] enabled clock source selection: [ ] in ternal rc [ ] external clock pll [ ] disabled [ ] pllx4 [ ] pllx8 lvd reset [ ] disabled [ ] highest threshold [ ] medium threshold [ ] lowest threshold watchdog selection: [ ] software ac tivation [ ] hard ware activation watchdog reset on halt: [ ] disabled [ ] enabled comments : . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . supply operating range in the applic ation: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . date: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . signature: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . important note: not all configurations are available. see table 21 on page 113 for authorized option byte combinations and ?ordering information scheme? on page 115. please download the latest versi on of this option list from: www.st.com memory size (check only one option): [ ] 1 k [ ] 1.5 k device type (check only one option): [ ] st7plites2y0 [ ] st7plites5y0 [ ] st7plite02y0 [ ] st7plite05y0 [ ] st7plite09y0 pdip16 [ ] tube so16 [ ] tape & reel [ ] tube qfn20 [ ] tape & reel [ ] tray
st7lite0xy0, st7litesxy0 117/124 15.3 development tools development tools for the st7 microcontrollers in- clude a complete range of hardware systems and software tools from stmicroelectronics and third- party tool suppliers. the range of tools includes solutions to help you evaluate microcontroller pe- ripherals, develop and debug your application, and program your microcontrollers. 15.3.1 starter kits st offers complete, affordable starter kits . starter kits are complete, affordable hardware/software tool packages that include features and samples to help you quickly start developing your applica- tion. 15.3.2 development and debugging tools application development for st7 is supported by fully optimizing c compilers and the st7 assem- bler-linker toolchain, which are all seamlessly in- tegrated in the st7 integrated development envi- ronments in order to facilitate the debugging and fine-tuning of your application. the cosmic c compiler is available in a free version that outputs up to 16kbytes of code. the range of hardware tools includes full-featured st7-emu3 series emulators , cost effective st7- dvp3 series emulators and the low-cost rlink in-circuit debugger/programmer. these tools are supported by the st7 toolset from stmicroelec- tronics, which includes the stvd7 integrated de- velopment environment (ide) with high-level lan- guage debugger, editor, project manager and inte- grated programming interface. 15.3.3 programming tools during the development cycle, the st7-dvp3 and st7-emu3 series emulators and the rlink pro- vide in-circuit programmi ng capability for program- ming the flash microcontroller on your application board. st also provides a low- cost dedicated in-circuit programmer, the st7-stick , as well as st7 socket boards which provide all the sockets re- quired for programming any of the devices in a specific st7 sub-family on a platform that can be used with any tool with in-circuit programming ca- pability for st7. for production programming of st7 devices, st?s third-party tool partners also provide a complete range of gang and automated programming solu- tions, which are ready to integrate into your pro- duction environment. 15.3.4 order codes for development and programming tools table 23 below lists the ordering codes for the st7lite0/st7lites development and program- ming tools. for additional ordering codes for spare parts and accessories, refer to the online product selector at www.st.com/mcu. 15.3.5 order codes for st7lite0/st7lites development tools table 23. development tool order codes for the st7lite0/st7lites family notes: 1. available from st or fr om raisonance, www.raisonance.com 2. usb connection to pc 3. includes connection kit for dip16/so16 only. see ?how to order an emu or dvp? in st product and tool selection guide for connection kit ordering information 4. add suffix /eu, /uk or /us fo r the power supply for your region 5. parallel port connection to pc mcu in-circuit debugger, rlink series 1) emulator programming tool st7flite02, st7flite05, st7flite09, st7flites2, st7flites5 starter kit without demo board starter kit with demo board dvp series emu series in-circuit programmer st socket boards and epbs stx-rlink 2) st7flite-sk/rais 2) st7mdt10- dvp3 3) st7mdt10- emu3 stx-rlink st7-stick 4)5) st7sb10-su0 4)
st7lite0xy0, st7litesxy0 118/124 15.4 st7 application notes table 24. st7 application notes identification description application examples an1658 serial numbering implementation an1720 managing the read-out protection in flash microcontrollers an1755 a high resolution/precision thermometer using st7 and ne555 an1756 choosing a dali implementation strategy with st7dali an1812 a high precision, low cost, single supply adc for positive and negative in- put voltages example drivers an 969 sci communication between st7 and pc an 970 spi communication between st7 and eeprom an 971 i2c communication between st7 and m24cxx eeprom an 972 st7 software spi master communication an 973 sci software communication with a pc using st72251 16-bit timer an 974 real time clock with st7 timer output compare an 976 driving a buzzer through st7 timer pwm function an 979 driving an analog keyboard with the st7 adc an 980 st7 keypad decoding techniques, implementing wake-up on keystroke an1017 using the st7 universal serial bus microcontroller an1041 using st7 pwm signal to generate analog output (sinuso?d) an1042 st7 routine for i2c slave mode management an1044 multiple interrupt sources management for st7 mcus an1045 st7 s/w implementation of i2c bus master an1046 uart emulation software an1047 managing reception errors with the st7 sci peripherals an1048 st7 software lcd driver an1078 pwm duty cycle switch implementing true 0% & 100% duty cycle an1082 description of the st72141 motor control peripherals registers an1083 st72141 bldc motor control software and flowchart example an1105 st7 pcan peripheral driver an1129 pwm management for bldc motor drives using the st72141 an1130 an introduction to sensorless brushless dc motor drive applications with the st72141 an1148 using the st7263 for designing a usb mouse an1149 handling suspend mode on a usb mouse an1180 using the st7263 kit to implement a usb game pad an1276 bldc motor start routine for the st72141 microcontroller an1321 using the st72141 motor control mcu in sensor mode an1325 using the st7 usb low-speed firmware v4.x an1445 emulated 16-bit slave spi an1475 developing an st7265x mass storage application an1504 starting a pwm signal directly at high level using the st7 16-bit timer an1602 16-bit timing operations using st7262 or st7263b st7 usb mcus an1633 device firmware upgrade (dfu) implementation in st7 non-usb applications an1712 generating a high resolution sinewave using st7 pwmart an1713 smbus slave driver for st7 i2c peripherals an1753 software uart using 12-bit art
st7lite0xy0, st7litesxy0 119/124 an1947 st7mc pmac sine wave motor control software library general purpose an1476 low cost power supply for home appliances an1526 st7flite0 quick reference note an1709 emc design for st microcontrollers an1752 st72324 quick reference note product evaluation an 910 performance benchmarking an 990 st7 benefits vs industry standard an1077 overview of enhanced can controllers for st7 and st9 mcus an1086 u435 can-do solutions for car multiplexing an1103 improved b-emf detection for low speed, low voltage with st72141 an1150 benchmark st72 vs pc16 an1151 performance comparison between st72254 & pc16f876 an1278 lin (local interconnect network) solutions product migration an1131 migrating applications from st72511/311/214/124 to st72521/321/324 an1322 migrating an application from st7263 rev.b to st7263b an1365 guidelines for migrating st72c254 applications to st72f264 an1604 how to use st7mdt1-train with st72f264 an2200 guidelines for migrating st7lite1x applications to st7flite1xb product optimization an 982 using st7 with ceramic resonator an1014 how to minimize the st7 power consumption an1015 software techniques for improving microcontroller emc performance an1040 monitoring the vbus signal for usb self-powered devices an1070 st7 checksum self-checking capability an1181 electrostatic discharge sensitive measurement an1324 calibrating the rc oscillator of the st7flite0 mcu using the mains an1502 emulated data eeprom with st7 hdflash memory an1529 extending the current & voltage capability on the st7265 vddf supply an1530 accurate timebase for low-cost st7 applications with internal rc oscilla- tor an1605 using an active rc to wakeup the st7lite0 from power saving mode an1636 understanding and minimizing adc conversion errors an1828 pir (passive infrared) detector using the st7flite05/09/superlite an1946 sensorless bldc motor control and bemf sampling methods with st7mc an1953 pfc for st7mc starter kit an1971 st7lite0 microcontrolled ballast programming and tools an 978 st7 visual develop software key debugging features an 983 key features of the cosmic st7 c-compiler package an 985 executing code in st7 ram an 986 using the indirect addressing mode with st7 an 987 st7 serial test controller programming an 988 starting with st7 assembly tool chain an1039 st7 math utility routines table 24. st7 application notes identification description
st7lite0xy0, st7litesxy0 120/124 an1071 half duplex usb-to-serial bridge using the st72611 usb microcontroller an1106 translating assembly code from hc05 to st7 an1179 programming st7 flash microcontrollers in remote isp mode (in-situ pro- gramming) an1446 using the st72521 emulator to debug an st72324 target application an1477 emulated data eeprom with xflash memory an1527 developing a usb smartcard reader with st7scr an1575 on-board programming methods for xflash and hdflash st7 mcus an1576 in-application programming (iap) drivers for st7 hdflash or xflash mcus an1577 device firmware upgrade (dfu) implementation for st7 usb applications an1601 software implementation for st7dali-eval an1603 using the st7 usb device firmware upgrade development kit (dfu-dk) an1635 st7 customer rom code release information an1754 data logging program for testing st7 applications via icc an1796 field updates for flash based st7 applications using a pc comm port an1900 hardware implementation for st7dali-eval an1904 st7mc three-phase ac induction motor control software library an1905 st7mc three-phase bldc motor control software library system optimization an1711 software techniques for compensating st7 adc errors an1827 implementation of sigma-delta adc with st7flite05/09 an2009 pwm management for 3-phase bldc motor drives using the st7fmc an2030 back emf detection during pwm on time by st7mc table 24. st7 application notes identification description
st7lite0xy0, st7litesxy0 121/124 16 known limitations 16.1 execution of btjx instruction description executing a btjx instruction jumps to a random address in the following co nditions: the jump goes to a lower address (jump backward) and the test is performed on a data located at the address 00ffh. 16.2 in-circuit programming of devices previously programmed with hardware watchdog option description in-circuit programming of devices configured with hardware watchdog (wdgsw bit in option byte 1 programmed to 0) requires certain precautions (see below). in-circuit programming uses icc mode. in this mode, the hardware watchdog is not automatical- ly deactivated as one might expect. as a conse- quence, internal resets are generated every 2 ms by the watchdog, thus preventing programming. the device factory configuration is software watchdog so this issue is not seen with devices that are programmed for the first time. for the same reason, devices programmed by the user with the software watchdog option are not impact- ed. the only devices impacted are those that have previously been programmed with the hardware watchdog option. workaround devices configured with hardware watchdog must be programmed using a specific program- ming mode that ignores the option byte settings. in this mode, an external clock, normally provided by the programming tool, has to be used. in st tools, this mode is called "icp options disabled". sockets on st programming tools (such as st7mdt10-epb) are controlled using "icp op- tions disabled" mode. devices can therefore be reprogrammed by plugging them in the st pro- gramming board socket, whatever the watchdog configuration. when using third-party tools, please refer the manufacturer's documentation to check how to ac- cess specific programming modes. if a tool does not have a mode that ignores the option byte set- tings, devices programmed with the hardware watchdog option cannot be reprogrammed using this tool. 16.3 in-circuit debugging with hardware watchdog in circuit debugging is impacted in the same way as in circuit programming by the activation of the hardware watchdog in icc mode. please refer to section 16.2 . 16.4 recommendations when lvd is enabled when the lvd is enabled, it is recommended not to connect a pull-up resistor or capacitor. a 10nf pull-down capacitor is required to filter noise on the reset line. 16.5 clearing active interrupts outside interrupt routine when an active interrupt request occurs at the same time as the related flag or interrupt mask is being cleared, the cc register may be corrupted. concurrent interrupt context the symptom does not occur when the interrupts are handled normally, i.e. when: ? the interrupt request is cleared (flag reset or in- terrupt mask) within its own interrupt routine ? the interrupt request is cleared (flag reset or in- terrupt mask) within any interrupt routine ? the interrupt request is cleared (flag reset or in- terrupt mask) in any part of the code while this in- terrupt is disabled if these conditions are not met, the symptom can be avoided by implementing the following se- quence: perform sim and rim operation before and after resetting an active interrupt request ex: sim reset flag or interrupt mask rim
st7lite0xy0, st7litesxy0 122/124 17 revision history table 25. revision history date revision description of changes 27-oct-04 3 revision number incremented from 2.5 to 3. 0 due to internal document management sys- tem change changed all references of adcdat to adcdr added emu3 emulator programming capability in table 23 clarification of read-out protection altered note 1 for section 13.2.3 on page 82 removing references to reset alteration of f cpu for slow and slow-wait modes in section 13.4.1 table and figure 59 on page 90 removed sentence relating to an effective change only after overflow for ck[1:0], page 56 added illegal opcode detection to page 1, section 8.4 on page 32 , section 12 on page 75 clarification of flas h read-out pr otection, section 4.5.1 on page 15 f pll value of 1mhz quoted as typical instead of a minimum in section 14.3.5.2 on page 92 updated f sck in section 13.10.1 on page 102 to f cpu /4 and f cpu /2 section 8.4.4 on page 36 : changed wording in avdie and avdf bit descriptions to ?...when the avdf bit is set? socket board development kit details added in table 24 on page 115 pwm signal diagram corrected, figure 36 on page 55 corrected count of reserved bits between 003bh to 007fh, table 2 on page 11 inserted note that rccr0 and rccr1 are erased if read-only flag is reset, section 7.1 on page 24 21-july-06 4 added qfn20 package modified section 2 on page 6 changed read operation paragraph in section 5.3 on page 17 modified note below figure 9 on page 18 and modified section 5.5 on page 19 modified note to section 7.1 on page 24 added note on illegal opcode reset to section 7.4.1 on page 27 added note 2 to eicr description on page 31 modified external interrupt function in section 10.2.1 on page 42 changed text on input capture before section 11.1.4 on page 51 modified text in section 11.1.5 on page 51 added important note in section 11.3.3.3 on page 62 changed note 1 in section 13.2 on page 82 modified values in section 13.2.2 on page 82 modified note 2 in section 13.3.4.1 on page 85 and section 13.3.4.2 on page 86 added note on clock stability and frequency accuracy to section 13.3.4.1 on page 85 , section 13.3.4.2 on page 86 , section 7.1 on page 24 and to osc option bit in section 15.1 on page 113 changed i s value and note 2 in section 13.8.1 on page 95 added note in figure 62 on page 95 changed figure 76 on page 101 and removed emc protection circuitry in figure 77 on page 101 (device works correctl y without these components) changed section 13.10.1 on page 102 (t su(ss ), t v(mo) and t h(mo) ) modified figure 79 (cpha=1) and figure 80 on page 103 (t v(mo) , t h(mo) ) added ecopack information to section 14 on page 109 modified figure 88 on page 110 (a1 and a swapped in the diagram) modified table 21 on page 112 modified section 15.2 on page 114 updated option list on page 116 changed section 15.3 on page 117 removed erratasheet section added section 16.4 and section 16.5 on page 121 revision history cont inued overleaf ...
st7lite0xy0, st7litesxy0 123/124 09-oct-06 5 removed qfn20 pinout and mechanical data. modified text in external interrupt function section in section 10.2.1 on page 42 modified table 24 on page 116 (and qfn20 rows in grey). added ?external clock source? on page 91 and figure 61 on page 91 modified description of cntr[11:0] bits in section 11.2.6 on page 56 updated option list on page 116 changed section 15.3 on page 117 19-nov-07 6 title of the doc ument modified modified locked bit description in section 8.4.4 on page 36 in table 1 on page 7 and section 13.2.2 on page 82 , note ?negative injection not allowed on pb0 and pb1 pins? replaced by ?negative injection not allowed on pb1 pin? added qfn20 package pinout (with new qfn20 mechanical data): figure 2 on page 6 and figure 86 on page 109 modified section 8.4.4 on page 36 removed one note in section 11.1.3.1 on page 49 modified section 13.7 on page 93 modified ?package mechanical data? on page 109 (values in inches rounded to 4 dec- imal digits) modified section 15.2 on page 114 (?ordering information scheme? on page 115 added and table removed) and option list on page 116 removed ?soldering information? section modified section 15.3.5 on page 117
st7lite0xy0, st7litesxy0 124/124 notes: please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particul ar purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in mi litary, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of ST7MDT10-DVP33

	To Download ST7MDT10-DVP33 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .